Datasheet > MSL-155B0

MSL-155B0

更新时间： 2024-09-17 03:48:15

品牌	Logo	应用领域
东贝光电 - UOT		/
页数	文件大小	规格书
3页	48K
描述
Surface Mount Bi-Color Chip LEDs

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数据手册

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MSL-155B0 数据手册

Surface Mount Bi-Color Chip LEDs

MSL-155XX SERIES

Description

Package Dimensions

The MSL-155xx , a series of bi-color Chip LED device ,

is designed in an industry standard package suitable for

SMT assembly method . This series contain different

LED die

A (Short wavelength)

LED die

B (Long wavelength)

0.50

(.020)

2.7

(.106)

combinations of Red & Green chips to provide broad

range choices in wavelength and intensity . They are

Cathode mark

all molded in water clear epoxy package.

PCB

1.4

Features

(0.055)

l Small Size

0.60

(.024)

0.90

l Industry Standard Footprint

l Compatible with IR Solder process

l Availalble in 8 mm Tape on 7"(178mm)

Diameter Reels

(0.036)

l Dual color

0.9

Polarity

(0.035)

Applications

Soldering Terminal

l Push-button backlighting

l LCD backlighting

l Symbol backlighting

l Front panel indicator

NOTE:

1. All dimensions are in millimeter (inches)

2. Tolerance is ± 0.1mm (.004") unless otherwise specified.

Absolute Maximum Ratings

@ T_A=25^oC

Units

Maximum Rating

Parameter

Symbol

I_FP

Peak Forward Current

DC Forward Current⁽¹⁾

I_F

Power Dissipation

P_D

Reverse Voltage ( I_R= 100 mA )

Operating Temperature Range

Storage Temperature Range

V_R

-20 to + 80

-30 to + 100

T_OPR

T_STG

^oC

Notes:

1. Derate linearly as shown in figure 4 for temperatures above 25^oC

Unity Opto Technology Co., Ltd.

12/11/2000

12 3

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