MSL-174G

更新时间： 2024-09-16 22:29:51

品牌	Logo	应用领域
东贝光电 - UOT		/
页数	文件大小	规格书
2页	37K
描述
Surface Mount Chip LEDs

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中文翻译

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数据手册

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MSL-174G 数据手册

Surface Mount Chip LEDs

MSL-174G

Package Dimensions

Description

CATHODE MARK

The MSL-174G, a GREEN source Chip

LED device, is designed in an indnstry standard

package suitable for SMT assembly method. It

utilizes GaP on GaP LED chip technology

and water clear epoxy package.

1.25

( 0.049 )

POLARITY

2.0

( 0.079)

1.40

1.25

(0.055)

(0.049)

0.80

0.30

(0.031)

( 0.012 )

Applications

PCB

l Small Size

0.40

(0.016)

lIndustry Standard Footprint(0805)

lCompatible with IR Solder process

lAvailalble in 8 mm Tape on 7"(178mm)

Diameteer Reels

R0.2

(0.008)

SOLDERING

TERMINAL

Recommended Solder Patterns

Features

lPush-Button Backlighting

lLCD Backlighting

lSymbol Backlighting

lFront Panel Indicator

1.20

0.90

(0.047)

(0.035)

NOTE:

1. All dimensions are in millimeter (inches)

2. Tolerance is ± 0.1mm (.004") unless otherwise specified.

Absolute Maximum Ratings

@ T_A=25^oC

Parameter

Peak Forward Current(1/10 Duty Cycle@1KHz )

DC Forward Current

Symbol Maximum Rating

Unit

I_FP

I_F

120

Power Dissipation

P_D

Reverse Voltage

V_R

-20^oC to +80^oC

-30^oC to +100^oC

Operating Temperature Range

Storage Temperature Range

T_OPR

T_STG

Unity Opto Technology Co., Ltd.

11/24/2000

中文翻译

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