MSC8122
Rev. 4, 1/2005
Freescale Semiconductor
Technical Data Advance Information
MSC8122
Quad Core 16-Bit Digital Signal Processor
The raw processing power of
this highly integrated system-
on- a-chip device will enable
developers to create next-
generation networking
SC140
SC140
SC140
Extended Core
SC140
products that offer
Extended Core
Extended Core
Extended Core
tremendous channel
MQBus
128
128
densities, while maintaining
system flexibility, scalability,
and upgradeability. The
MSC8122 is offered in three
core speed levels: 300, 400,
and 500 MHz.
SQBus
Boot
ROM
64
Local Bus
IP Master
32 Timers
UART
Memory
Controller
M2
RAM
RS-232
What’s New?
Rev. 4 includes the following
changes:
4 TDMs
GPIO Pins
Interrupts
PLL/Clock
PLL
IPBus
32
•
•
•
Package type is FC-PBGA for
all frequencies.
GPIO
GIC
Changes the low voltage 300
MHz core power to 1.1 V.
Table 1-4 updates the
definitions of HRESET and
SRESET.
JTAG Port
JTAG
8 Hardware
Semaphores
MII/RMII/SMII
DSI Port
Ethernet
Internal Local Bus
SIU
64
Direct
Slave
Interface
(DSI)
•
•
•
Figure 2-1 adds undershoot
and overshoot values for VDDH
Table 2-24 updates the RMII
timing.
Updates and rearranges
Chapter 4.
.
System
Interface
32/64
DMA
Bridge
Registers
System Bus
32/64
64
Memory
Controller
Internal System Bus
Figure 1. MSC8122 Block Diagram
The MSC8122 is a highly integrated system-on-a-chip that combines four SC140 extended cores with an RS-232
serial interface, four time-division multiplexed (TDM) serial interfaces, thirty-two general-purpose timers, a
flexible system interface unit (SIU), an Ethernet interface, and a multi-channel DMA engine. The four extended
cores can deliver a total 4800/6400/8000 DSP MMACS performance at 300/400/500 MHz.
Each core has four arithmetic logic units (ALUs), internal memory, a write buffer, and two interrupt controllers.
The MSC8122 targets high-bandwidth highly computational DSP applications and is optimized for wireless
transcoding and packet telephony as well as high-bandwidth base station applications. The MSC8122 delivers
enhanced performance while maintaining low power dissipation and greatly reducing system cost.
Note: This document contains information on a new product. Specifications and information herein are subject to change without notice.
© Freescale Semiconductor, Inc., 2004, 2005. All rights reserved.