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MPZ1608S300ATA00 PDF预览

MPZ1608S300ATA00

更新时间: 2024-09-19 07:12:39
品牌 Logo 应用领域
东电化 - TDK /
页数 文件大小 规格书
4页 105K
描述
Passive Filter

MPZ1608S300ATA00 数据手册

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(1/4)  
Conformity to RoHS Directive  
Chip Beads(SMD)  
For Power Line  
MPZ Series MPZ1608 Type  
FEATURES  
MATERIAL CHARACTERISTICS  
B material: This type is perfectly suited for fast digital signals. By  
equalizing R components and X components that  
beads possess at a frequency of 5MHz, it is able to  
suppress overshooting, undershooting and ringing of  
fast digital signals.  
• This type is the best for energy-saving in the low DC resistance.  
• The products contain no lead and also support lead-free  
soldering.  
• It is a product conforming to RoHS directive.  
APPLICATIONS  
R material:For wide frequency applications calling for broad  
impedance characteristics.  
Removal of power line noises of cellular phones, PCs, note PCs,  
TVs, TV tuners, STBs, audio players, DVDs, DSCs, DVCs, game  
machines, digital photo frames, car navigation system, PNDs, etc.  
For digital signal line applications calling requiring  
good waveform integrity. Impedance values selected  
for effectiveness at 10 to 200MHz.  
S material: Standard type that features impedance characteristics  
similar to those of a typical ferrite core.  
PRODUCT IDENTIFICATION  
MPZ 1608 S 221 A  
T
For signal line applications in which the blocking region  
is near 100MHz. Impedance values selected for  
effectiveness at 40 to 300MHz.  
(1) (2) (3) (4) (5) (6)  
(1) Series name  
Y material: High frequency range type intended for the 100MHz  
region and above.  
(2) Dimensions L×W  
(3) Material code  
For signal line applications in which the signal  
frequency is far from the cutoff frequency. Impedance  
values selected for effectiveness at 80 to 400MHz.  
D material:For applications calling for low insertion loss at low  
frequencies and sharply increasing impedance at high  
frequencies. Designed for high impedance at high  
frequencies (300MHz to 1GHz) for signal line  
applications.  
(4) Nominal impedance  
221: 220at 100MHz  
(5) Characteristic type  
(6) Packaging style  
T: Taping  
HANDLING AND PRECAUTIONS  
• Before soldering, be sure to preheat components. The preheat-  
ing temperature should be set so that the temperature difference  
between the solder temperature and product temperature does  
not exceed 150°C.  
TYPICAL MATERIAL CHARACTERISTICS  
2500  
D
• After mounting components onto the printed circuit board, do not  
apply stress through board bending or mishandling.  
• Do not expose the inductors to stray magnetic fields.  
• Avoid static electricity discharge during handling.  
• When hand soldering, apply the soldering iron to the printed cir-  
cuit board only. Temperature of the iron tip should not exceed  
350°C. Soldering time should not exceed 3 seconds.  
2000  
Y
1500  
1000  
S
R
500  
0
B
10  
100  
1000  
Frequency(MHz)  
• Conformity to RoHS Directive: This means that, in conformity with EU Directive 2002/95/EC, lead, cadmium, mercury, hexavalent chromium, and specific  
bromine-based flame retardants, PBB and PBDE, have not been used, except for exempted applications.  
• Please contact our Sales office when your application are considered the following:  
The device’s failure or malfunction may directly endanger human life (e.g. application for automobile/aircraft/medical/nuclear power devices, etc.)  
• All specifications are subject to change without notice.  
011-01 / 20100324 / e9413_mpz1608.

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