Datasheet > MPC860TZQ50D4R2

MPC860TZQ50D4R2

更新时间： 2024-02-17 04:20:55

品牌	Logo	应用领域
恩智浦 - NXP		时钟外围集成电路
页数	文件大小	规格书
78页	529K
描述
32-BIT, 50MHz, RISC PROCESSOR, PBGA357, 25 X 25 MM, 1.27 MM PITCH, PLASTIC, BGA-357

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MPC860TZQ50D4R2 技术参数

是否无铅：	含铅	是否Rohs认证：	不符合
生命周期：	Transferred	零件包装代码：	BGA
包装说明：	25 X 25 MM, 1.27 MM PITCH, PLASTIC, BGA-357	针数：	357
Reach Compliance Code：	not_compliant	ECCN代码：	3A991.A.2
HTS代码：	8542.31.00.01	风险等级：	5.09
Is Samacsys：	N	地址总线宽度：	32
位大小：	32	边界扫描：	YES
最大时钟频率：	50 MHz	外部数据总线宽度：	32
格式：	FIXED POINT	集成缓存：	YES
JESD-30 代码：	S-PBGA-B357	JESD-609代码：	e0
长度：	25 mm	低功率模式：	YES
湿度敏感等级：	3	端子数量：	357
最低工作温度：		封装主体材料：	PLASTIC/EPOXY
封装代码：	BGA	封装等效代码：	BGA357,19X19,50
封装形状：	SQUARE	封装形式：	GRID ARRAY
峰值回流温度（摄氏度）：	245	电源：	3.3 V
认证状态：	Not Qualified	座面最大高度：	2.52 mm
速度：	50 MHz	子类别：	Microprocessors
最大供电电压：	3.465 V	最小供电电压：	3.135 V
标称供电电压：	3.3 V	表面贴装：	YES
技术：	CMOS	端子面层：	TIN LEAD
端子形式：	BALL	端子节距：	1.27 mm
端子位置：	BOTTOM	处于峰值回流温度下的最长时间：	30
宽度：	25 mm	uPs/uCs/外围集成电路类型：	MICROPROCESSOR, RISC
Base Number Matches：	1

MPC860TZQ50D4R2 数据手册

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Document Number: MPC860EC

Rev. 9

02/2012

1...75 76 7778

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与MPC860TZQ50D4R2相关器件

型号	品牌	描述	获取价格	数据表
MPC860TZQ66D4	FREESCALE	Hardware Specifications	获取价格
MPC860TZQ66D4	NXP	32-BIT, 66MHz, RISC PROCESSOR, PBGA357, 25 X 25 MM, 1.27 MM PITCH, PLASTIC, BGA-357	获取价格
MPC860TZQ80D4	FREESCALE	Hardware Specifications	获取价格
MPC860TZQ80D4	ROCHESTER	32-BIT, 80MHz, RISC PROCESSOR, PBGA357, 25 X 25 MM, 1.27 MM PITCH, PLASTIC, BGA-357	获取价格
MPC860TZQ80D4	NXP	32-BIT, 80MHz, RISC PROCESSOR, PBGA357, 25 X 25 MM, 1.27 MM PITCH, PLASTIC, BGA-357	获取价格
MPC860UM	MOTOROLA	Errata to the MPC860 PowerQUICC⑩ Family User’	获取价格

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