Document Number: MPC5533
Rev. 0.0, 10 Oct 2008
Freescale Semiconductor
Data Sheet: Technical Data
MPC5533
Microcontroller Data Sheet
by: Microcontroller Division
Contents
This document provides electrical specifications, pin
assignments, and package diagrams for the MPC5533
microcontroller device. For functional characteristics,
refer to the MPC5534 Microcontroller Reference
Manual.
1
2
3
Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Ordering Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . 4
3.1 Maximum Rating . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
3.2 Thermal Characteristics . . . . . . . . . . . . . . . . . . . . . 5
3.3 Package. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
3.4 EMI Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . 8
3.5 ESD. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
3.6 VRC and POR Electrical Specifications . . . . . . . . . 9
3.7 Power-Up/Down Sequencing. . . . . . . . . . . . . . . . . 10
3.8 DC Electrical Specifications . . . . . . . . . . . . . . . . . 13
3.9 Oscillator and FMPLL Electrical Characteristics . . 20
3.10 eQADC Electrical Characteristics . . . . . . . . . . . . . 22
3.11 H7Fb Flash Memory Electrical Characteristics . . . 23
3.12 AC Specifications . . . . . . . . . . . . . . . . . . . . . . . . . 25
3.13 AC Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
1
Overview
The MPC5533 microcontroller (MCU) is a member of
the MPC5500 family of microcontrollers built on the
Power Architecture™ embedded technology. This
family of parts has many new features coupled with high
performance CMOS technology to provide substantial
reduction of cost per feature and significant performance
improvement over the MPC500 family.
4
5
Mechanicals. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43
4.1 MPC5533 208 MAP BGA Pinout. . . . . . . . . . . . . . 43
4.2 MPC5533 324 PBGA Pinout . . . . . . . . . . . . . . . . . 44
4.3 MPC5533 208-Pin Package Dimensions. . . . . . . . 45
4.4 MPC5533 324-Pin Package Dimensions. . . . . . . . 47
The host processor core of this device complies with the
Power Architecture embedded category that is 100%
user-mode compatible (including floating point library)
with the original Power PC™ user instruction set
architecture (UISA). The embedded architecture
enhancements improve the performance in embedded
applications. The core also has additional instructions,
including digital signal processing (DSP) instructions,
beyond the original Power PC instruction set.
Revision History for the MPC5533 Data Sheet . . . . . . . 49
© Freescale Semiconductor, Inc., 2008. All rights reserved.