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MPC5533MVF40

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Microcontroller Data Sheet

MPC5533MVF40 数据手册

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Document Number: MPC5533  
Rev. 0.0, 10 Oct 2008  
Freescale Semiconductor  
Data Sheet: Technical Data  
MPC5533  
Microcontroller Data Sheet  
by: Microcontroller Division  
Contents  
This document provides electrical specifications, pin  
assignments, and package diagrams for the MPC5533  
microcontroller device. For functional characteristics,  
refer to the MPC5534 Microcontroller Reference  
Manual.  
1
2
3
Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1  
Ordering Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3  
Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . 4  
3.1 Maximum Rating . . . . . . . . . . . . . . . . . . . . . . . . . . . 4  
3.2 Thermal Characteristics . . . . . . . . . . . . . . . . . . . . . 5  
3.3 Package. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8  
3.4 EMI Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . 8  
3.5 ESD. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9  
3.6 VRC and POR Electrical Specifications . . . . . . . . . 9  
3.7 Power-Up/Down Sequencing. . . . . . . . . . . . . . . . . 10  
3.8 DC Electrical Specifications . . . . . . . . . . . . . . . . . 13  
3.9 Oscillator and FMPLL Electrical Characteristics . . 20  
3.10 eQADC Electrical Characteristics . . . . . . . . . . . . . 22  
3.11 H7Fb Flash Memory Electrical Characteristics . . . 23  
3.12 AC Specifications . . . . . . . . . . . . . . . . . . . . . . . . . 25  
3.13 AC Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27  
1
Overview  
The MPC5533 microcontroller (MCU) is a member of  
the MPC5500 family of microcontrollers built on the  
Power Architecture™ embedded technology. This  
family of parts has many new features coupled with high  
performance CMOS technology to provide substantial  
reduction of cost per feature and significant performance  
improvement over the MPC500 family.  
4
5
Mechanicals. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43  
4.1 MPC5533 208 MAP BGA Pinout. . . . . . . . . . . . . . 43  
4.2 MPC5533 324 PBGA Pinout . . . . . . . . . . . . . . . . . 44  
4.3 MPC5533 208-Pin Package Dimensions. . . . . . . . 45  
4.4 MPC5533 324-Pin Package Dimensions. . . . . . . . 47  
The host processor core of this device complies with the  
Power Architecture embedded category that is 100%  
user-mode compatible (including floating point library)  
with the original Power PC™ user instruction set  
architecture (UISA). The embedded architecture  
enhancements improve the performance in embedded  
applications. The core also has additional instructions,  
including digital signal processing (DSP) instructions,  
beyond the original Power PC instruction set.  
Revision History for the MPC5533 Data Sheet . . . . . . . 49  
© Freescale Semiconductor, Inc., 2008. All rights reserved.  

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