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MMZ2012R301A PDF预览

MMZ2012R301A

更新时间: 2024-09-17 00:48:51
品牌 Logo 应用领域
东电化 - TDK /
页数 文件大小 规格书
4页 104K
描述
Chip Beads(SMD) For Signal Line

MMZ2012R301A 数据手册

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(1/4)  
Conformity to RoHS Directive  
Chip Beads(SMD)  
For Signal Line  
MMZ Series MMZ2012 Type  
FEATURES  
MATERIAL CHARACTERISTICS  
• Chip bead(impeder), MMZ series offers 4 construction materials.  
• Size standardized for use by automatic assembly equipment.  
No preferred orientation.  
R material: For wide frequency applications calling for broad  
impedance characteristics.  
For digital signal line applications calling requiring  
good waveform integrity. Impedance values selected  
for effectiveness at 10 to 200MHz.  
• Either flow or reflow soldering methods can be used due to  
electroplating of the terminal electrodes.  
• High reliability due to an entirely monolithic structure.  
• Closed magnetic circuit structure allows high-density installation  
while preventing crosstalk between circuits.  
• Low DC resistance structure of electrode prevents wasteful  
electric power consumption.  
S material: Standard type that features impedance characteristics  
similar to those of a typical ferrite core.  
For signal line applications in which the blocking region  
is near 100MHz. Impedance values selected for effec-  
tiveness at 40 to 300MHz.  
• The products contain no lead and also support lead-free  
soldering.  
Y material: High frequency range type intended for the 100MHz  
region and above.  
• It is a product conforming to RoHS directive.  
For signal line applications in which the signal fre-  
quency is far from the cutoff frequency. Impedance val-  
ues selected for effectiveness at 80 to 400MHz.  
D material: For applications calling for low insertion loss at low fre-  
quencies and sharply increasing impedance at high  
frequencies. Designed for high impedance at high fre-  
quencies (200 to 500MHz) for signal line applications.  
APPLICATIONS  
Removal of signal line noises of cellular phones, PCs, note PCs,  
TVs, TV tuners, STBs, audio players, DVDs, DSCs, DVCs, game  
machines, digital photo frames, car navigation system, PNDs, etc.  
PRODUCT IDENTIFICATION  
TYPICAL MATERIAL CHARACTERISTICS  
MMZ 2012  
R
121  
A
T
(1) (2) (3) (4) (5) (6)  
2500  
(1) Series name  
2000  
(2) Dimensions L× W  
(3) Material code  
(4) Nominal impedance  
121:120Ω at 100MHz  
(5) Characteristic type  
(6) Packaging style  
T:Taping  
Y
1500  
1000  
D
S
R
500  
0
10  
100  
1000  
Frequency(MHz)  
HANDLING AND PRECAUTIONS  
• Before soldering, be sure to preheat components. The preheat-  
ing temperature should be set so that the temperature difference  
between the solder temperature and product temperature does  
not exceed 150°C.  
• After mounting components onto the printed circuit board, do not  
apply stress through board bending or mishandling.  
• Do not expose the inductors to stray magnetic fields.  
• Avoid static electricity discharge during handling.  
• When hand soldering, apply the soldering iron to the printed cir-  
cuit board only. Temperature of the iron tip should not exceed  
350°C. Soldering time should not exceed 3 seconds.  
• Conformity to RoHS Directive: This means that, in conformity with EU Directive 2002/95/EC, lead, cadmium, mercury, hexavalent chromium, and specific  
bromine-based flame retardants, PBB and PBDE, have not been used, except for exempted applications.  
• Please contact our Sales office when your application are considered the following:  
The device’s failure or malfunction may directly endanger human life (e.g. application for automobile/aircraft/medical/nuclear power devices, etc.)  
• All specifications are subject to change without notice.  
007-02 / 20090921 / e9412_mmz2012.

MMZ2012R301A 替代型号

型号 品牌 替代类型 描述 数据表
MMZ2012R301AT TDK

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Ferrite Chip, 1 Function(s), 0.6A, HALOGEN FREE AND ROHS COMPLIANT, EIA STD PACKAGE SIZE 0
MMZ2012R301AT000 TDK

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Ferrite Chip, 1 Function(s), 0.6A,

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