Document Number: MMZ09312B
Rev. 1, 2/2012
Freescale Semiconductor
Technical Data
Heterojunction Bipolar Transistor
Technology (InGaP HBT)
MMZ09312BT1
High Efficiency/Linearity Amplifier
The MMZ09312B is a 2--stage high efficiency, Class AB InGaP HBT
amplifier designed for use as a linear driver amplifier in wireless base station
applications as well as an output stage in femtocell or repeater applications. It
is suitable for applications with frequencies from 400 to 1000 MHz such as
CDMA, GSM, LTE and ZigBeeR at operating voltages from 3 to 5 Volts. The
amplifier is housed in a cost--effective, surface mount QFN plastic package.
400--1000 MHz, 31.7 dB
29.6 dBm
InGaP HBT
•
Typical Performance: VCC1 = VCC2 = VBIAS = 5 Volts, ICQ = 74 mA
P
G
ACPR
(dBc)
PAE
(%)
out
ps
Frequency
900 MHz
750 MHz
(dBm)
(dB)
31.5
32.0
Test Signal
24
--50.0
--50.0
26.0
15.3
IS--95 CDMA
17.5
LTE
10/20 MHz
CASE 2131--01
QFN 3x3
450 MHz
29
33.0
--40.0
57.0
ZigBee
PLASTIC
Features
•
•
•
•
•
•
•
•
•
•
Frequency: 400--1000 MHz
P1dB: 29.6 dBm @ 900 MHz
Power Gain: 31.7 dB @ 900 MHz
OIP3: 42 dBm @ 900 MHz
Active Bias Control (adjustable externally)
Single 3 to 5 Volt Supply
Performs Well with Digital Predistortion Systems
Single--ended Power Detector
Cost--effective QFN Surface Mount Package
In Tape and Reel. T1 Suffix = 1,000 Units, 12 mm Tape Width, 7 inch Reel.
Table 1. Typical Performance (1)
Table 2. Maximum Ratings
Rating
Supply Voltage
Symbol
Value
Unit
V
450
MHz
900
MHz
Characteristic
Symbol
Unit
dB
V
6
550
CC
CC
Small--Signal Gain (S21)
Input Return Loss (S11)
Output Return Loss (S22)
G
33.8
-- 2 2
-- 2 5
28.8
31.7
-- 1 5
-- 1 8
29.6
p
Supply Current
I
mA
dBm
°C
IRL
ORL
P1dB
dB
RF Input Power
P
14
in
dB
Storage Temperature Range
T
stg
--65 to +150
150
Power Output @ 1dB
Compression
dBm
(2)
Junction Temperature
T
J
°C
2. For reliable operation, the junction temperature should not
1. V
= V
= V
= 5 Vdc, T = 25°C, 50 ohm system, CW
BIAS A
CC1
CC2
exceed 150°C.
Application Circuit
Table 3. Thermal Characteristics
(3)
Characteristic
Symbol
Value
Unit
Thermal Resistance, Junction to Case
R
θ
56
°C/W
JC
Case Temperature 84°C, V = V
= V
= 5 Vdc
BIAS
CC1
CC2
3. Refer to AN1955, Thermal Measurement Methodology of RF Power Amplifiers. Go to http://www.freescale.com/rf.
Select Documentation/Application Notes -- AN1955.
© Freescale Semiconductor, Inc., 2011--2012. All rights reserved.
MMZ09312BT1
RF Device Data
Freescale Semiconductor, Inc.
1