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MMZ1005_09 PDF预览

MMZ1005_09

更新时间: 2024-11-16 11:54:03
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描述
Chip Beads(SMD) For Signal Line

MMZ1005_09 数据手册

 浏览型号MMZ1005_09的Datasheet PDF文件第2页浏览型号MMZ1005_09的Datasheet PDF文件第3页 
(1/3)  
Conformity to RoHS Directive  
Chip Beads(SMD)  
For Signal Line  
MMZ Series MMZ1005-E Type  
FEATURES  
PRODUCT IDENTIFICATION  
MMZ 1005 601  
(1) (2) (3) (4) (5) (6)  
• Compared with the existing MMZ1005 type, this new product  
has broad-band impedance values for higher frequency ranges.  
• Size standardized for use by automatic assembly equipment.  
No preferred orientation.  
• Electroplated terminal electrodes accommodate reflow  
soldering.  
• High reliability due to an entirely monolithic structure.  
• Closed magnetic circuit structure allows high-density installation  
while preventing crosstalk between circuits.  
• Low DC resistance structure of electrode prevents wasteful  
electric power consumption.  
S
E
T
(1) Series name  
(2) Dimensions L× W  
(3) Material code  
(4) Nominal impedance  
601:600Ω at 100MHz  
(5) Characteristic type  
(6) Packaging style  
T:Taping  
• It is a product conforming to RoHS directive.  
APPLICATIONS  
PACKAGING STYLE AND QUANTITIES  
Removal of signal line noises of cellular phones, PCs, note PCs,  
TVs, TV tuners, STBs, audio players, DVDs, DSCs, DVCs, game  
machines, digital photo frames, car navigation system, PNDs, etc.  
Packaging style  
Quantity  
Taping  
10000 pieces/reel  
HANDLING AND PRECAUTIONS  
TEMPERATURE RANGES  
• Before soldering, be sure to preheat components. The preheat-  
ing temperature should be set so that the temperature difference  
between the solder temperature and product temperature does  
not exceed 150°C.  
Operating/storage  
–55 to +125°C  
SHAPES AND DIMENSIONS/RECOMMENDED PC BOARD  
PATTERN  
• After mounting components onto the printed circuit board, do not  
apply stress through board bending or mishandling.  
• Do not expose the inductors to stray magnetic fields.  
• Avoid static electricity discharge during handling.  
• When hand soldering, apply the soldering iron to the printed cir-  
cuit board only. Temperature of the iron tip should not exceed  
350°C. Soldering time should not exceed 3 seconds.  
1 0.05  
0.5  
0.4  
0.5  
0.1min.  
Weight: 1mg  
Dimensions in mm  
RECOMMENDED SOLDERING CONDITION  
REFLOW SOLDERING  
ELECTRICAL CHARACTERISTICS  
Impedance(Ω)∗  
DC  
Rated  
Part No.  
resistance current  
[100MHz]  
[1GHz]  
10s max.  
(Ω)max.  
0.70  
1.10  
1.65  
0.85  
1.25  
1.70  
2.20  
2.30  
0.70  
1.00  
0.70  
1.00  
1.50  
(mA)max.  
250 to 260˚C  
230˚C  
MMZ1005S601E  
MMZ1005S102E  
MMZ1005S182E  
MMZ1005A601E  
MMZ1005A102E  
MMZ1005A152E  
MMZ1005A182E  
MMZ1005A222E  
MMZ1005D121E  
MMZ1005D221E  
MMZ1005F470E  
MMZ1005F750E  
MMZ1005F121E  
600 25%  
1000 25%  
1800 25%  
600 25%  
1000 25%  
1500 25%  
1800 25%  
2200 25%  
120 25%  
220 25%  
47 25%  
1000 40%  
1400 40%  
1800 40%  
1400 40%  
2000 40%  
2300 40%  
2700 40%  
3000 40%  
1000 40%  
1700 40%  
800 40%  
300  
250  
200  
300  
250  
230  
200  
150  
300  
250  
300  
250  
200  
Natural  
cooling  
180˚C  
150˚C  
Preheating  
60 to 120s  
Soldering  
30 to 60s  
Time(s)  
75 25%  
120 25%  
1500 40%  
2300 40%  
Test equipment: E4991A or equivalent  
Test tool: 16192A or equivalent  
Test temperature: 25 10°C  
• Conformity to RoHS Directive: This means that, in conformity with EU Directive 2002/95/EC, lead, cadmium, mercury, hexavalent chromium, and specific  
bromine-based flame retardants, PBB and PBDE, have not been used, except for exempted applications.  
• Please contact our Sales office when your application are considered the following:  
The device’s failure or malfunction may directly endanger human life (e.g. application for automobile/aircraft/medical/nuclear power devices, etc.)  
• All specifications are subject to change without notice.  
002-01 / 20090914 / e9412_mmz1005e.

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