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MMSZ5258ET1 PDF预览

MMSZ5258ET1

更新时间： 2024-09-16 04:48:31
品牌 Logo 应用领域
安森美 - ONSEMI /
页数 文件大小 规格书
6页 165K
描述
36V, 0.5W, SILICON, UNIDIRECTIONAL VOLTAGE REGULATOR DIODE, PLASTIC, CASE 425-04, 2 PIN

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MMSZ5258ET1 数据手册

 浏览型号MMSZ5258ET1的Datasheet PDF文件第2页浏览型号MMSZ5258ET1的Datasheet PDF文件第3页浏览型号MMSZ5258ET1的Datasheet PDF文件第4页浏览型号MMSZ5258ET1的Datasheet PDF文件第5页浏览型号MMSZ5258ET1的Datasheet PDF文件第6页 
MMSZ52xxET1 Series,  
SZMMSZ52xxET1G Series  
Zener Voltage Regulators  
500 mW SOD−123 Surface Mount  
Three complete series of Zener diodes are offered in the convenient,  
surface mount plastic SOD−123 package. These devices provide a  
convenient alternative to the leadless 34−package style.  
http://onsemi.com  
1
2
Features  
Cathode  
Anode  
• 500 mW Rating on FR−4 or FR−5 Board  
• Wide Zener Reverse Voltage Range − 2.4 V to 110 V  
• Package Designed for Optimal Automated Board Assembly  
• Small Package Size for High Density Applications  
• General Purpose, Medium Current  
SOD−123  
CASE 425  
STYLE 1  
2
1
• ESD Rating of Class 3 (>16 kV) per Human Body Model  
• Peak Power − 225 W (8 x 20 ms)  
• AEC−Q101 Qualified and PPAP Capable  
MARKING DIAGRAM  
• SZ Prefix for Automotive and Other Applications Requiring Unique  
Site and Control Change Requirements  
xxx M G  
1
G
• Pb−Free Packages are Available  
Mechanical Characteristics:  
xxx = Device Code (Refer to page 2)  
CASE: Void-free, transfer-molded, thermosetting plastic case  
FINISH: Corrosion resistant finish, easily solderable  
MAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES:  
260°C for 10 Seconds  
POLARITY: Cathode indicated by polarity band  
FLAMMABILITY RATING: UL 94 V−0  
M
G
= Date Code  
= Pb−Free Package  
(Note: Microdot may be in either location)  
ORDERING INFORMATION  
†
Device  
Package  
Shipping  
MMSZ52xxET1  
SOD−123  
3000 / Tape &  
Reel  
MAXIMUM RATINGS  
Rating  
Symbol  
Max  
Unit  
MMSZ52xxET1G  
SOD−123  
(Pb−Free)  
3000 / Tape &  
Reel  
Peak Power Dissipation @ 20 ms (Note 1)  
P
pk  
225  
W
@ T ≤ 25°C  
L
Total Power Dissipation on FR−5 Board,  
P
D
SZMMSZ52xxET1G SOD−123  
(Pb−Free)  
3000 / Tape &  
Reel  
500  
6.7  
mW  
mW/°C  
(Note 3) @ T = 75°C  
L
Derated above 75°C  
MMSZ52xxET3  
SOD−123  
10000 / Tape &  
Reel  
Thermal Resistance, (Note 2)  
Junction−to−Ambient  
R
340  
150  
°C/W  
°C/W  
°C  
q
JA  
Thermal Resistance, (Note 2)  
Junction−to−Lead  
R
q
JL  
MMSZ52xxET3G  
SOD−123  
(Pb−Free)  
10000 / Tape &  
Reel  
Junction and Storage Temperature Range  
T , T  
J
−55 to  
+150  
stg  
†For information on tape and reel specifications,  
including part orientation and tape sizes, please  
refer to our Tape and Reel Packaging Specifications  
Brochure, BRD8011/D.  
Stresses exceeding Maximum Ratings may damage the device. Maximum  
Ratings are stress ratings only. Functional operation above the Recommended  
Operating Conditions is not implied. Extended exposure to stresses above the  
Recommended Operating Conditions may affect device reliability.  
1. Nonrepetitive current pulse per Figure 11.  
2. Thermal Resistance measurement obtained via infrared Scan Method.  
3. FR−5 = 3.5 x 1.5 inches, using the minimum recommended footprint.  
DEVICE MARKING INFORMATION  
See specific marking information in the device marking  
column of the Electrical Characteristics table on page 2 of  
this data sheet.  
© Semiconductor Components Industries, LLC, 2011  
1
Publication Order Number:  
November, 2011 − Rev. 7  
MMSZ5221ET1/D  
 
123456

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