MM5ZxxxST1G Series,
SZMM5ZxxxST1G Series
Zener Voltage Regulators
300 mW SOD−523 Surface Mount
This series of Zener diodes is packaged in a SOD−523 surface
mount package. They are designed to provide voltage regulation
protection and are especially attractive in situations where space is at a
premium. They are well suited for applications such as cellular
phones, hand held portables, and high density PC boards.
http://onsemi.com
SOD−523
CASE 502
Specification Features
• Standard Zener Breakdown Voltage Range −2.4 V to 18 V
• Steady State Power Rating of 200 mW
• Small Body Outline Dimensions:
1
2
0.047″ x 0.032″ (1.20 mm x 0.80 mm)
Cathode
Anode
• Low Body Height: 0.028″ (0.7 mm)
• ESD Rating of Class 3 (> 16 kV) per Human Body Model
MARKING DIAGRAM
• Tight Tolerance V
Z
• SZ Prefix for Automotive and Other Applications Requiring Unique
Site and Control Change Requirements; AEC−Q101 Qualified and
PPAP Capable
XX MG
G
2
1
• These Devices are Pb−Free and are RoHS Compliant*
XX = Specific Device Code
Mechanical Characteristics
CASE: Void-free, transfer-molded, thermosetting plastic
Epoxy Meets UL 94, V−0
LEAD FINISH: 100% Matte Sn (Tin)
MOUNTING POSITION: Any
M
Date Code*
G
= Pb−Free Package
(Note: Microdot may be in either location)
*Date Code orientation may vary depending
upon manufacturing location.
QUALIFIED MAX REFLOW TEMPERATURE: 260°C
Device Meets MSL 1 Requirements
ORDERING INFORMATION
MAXIMUM RATINGS
†
Device
Package
Shipping
Rating
Symbol
Max
Unit
MM5ZxxxST1G
SOD−523**
3,000 /
Total Device Dissipation FR−5 Board,
P
Tape & Reel
D
(Note 1) @ T = 25°C
300
1.5
mW
A
SZMM5ZxxxST1G SOD−523**
SZMM5ZxxxST5G SOD−523**
3,000 /
Tape & Reel
Derate above 25°C
mW/°C
Thermal Resistance from
Junction−to−Ambient
R
390
°C/W
q
JA
8,000 /
Tape & Reel
Junction and Storage Temperature Range
T , T
J
−65 to
+150
°C
stg
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. FR−4 Minimum Pad.
**This package is inherently Pb−Free.
DEVICE MARKING INFORMATION
See specific marking information in the device marking
column of the Electrical Characteristics table on page 2 of
this data sheet.
*For additional information on our Pb−Free strategy and soldering details, please
download the ON Semiconductor Soldering and Mounting Techniques
Reference Manual, SOLDERRM/D.
© Semiconductor Components Industries, LLC, 2013
1
Publication Order Number:
July, 2013 − Rev. 9
MM5Z2V4ST1/D