MM5ZxxxT1G Series,
SZMM5ZxxxT1G Series
Zener Voltage Regulators
300 mW SOD−523 Surface Mount
This series of Zener diodes is packaged in a SOD−523 surface
mount package. They are designed to provide voltage regulation
protection and are especially attractive in situations where space is at a
premium. They are well suited for applications such as cellular
phones, hand held portables, and high density PC boards.
http://onsemi.com
SOD−523
CASE 502
STYLE 1
Specification Features:
• Standard Zener Breakdown Voltage Range − 2.4 V to 75 V
• Steady State Power Rating of 300 mW
• Small Body Outline Dimensions:
0.047″ x 0.032″ (1.20 mm x 0.80 mm)
1
2
• Low Body Height: 0.028″ (0.7 mm)
• ESD Rating of Class 3 (> 16 kV) per Human Body Model
Cathode
Anode
• AEC−Q101 Qualified and PPAP Capable − SZMM5ZxxxT1G
• SZ Prefix for Automotive and Other Applications Requiring Unique
Site and Control Change Requirements
• These are Pb−Free Devices*
MARKING DIAGRAM
XX M G
G
2
1
Mechanical Characteristics:
CASE: Void-free, transfer-molded, thermosetting plastic
Epoxy Meets UL 94 V−0
LEAD FINISH: 100% Matte Sn (Tin)
MOUNTING POSITION: Any
XX = Specific Device Code
M
= Date Code*
G
= Pb−Free Package
(Note: Microdot may be in either location)
*Date Code orientation may vary depending
upon manufacturing location.
QUALIFIED MAX REFLOW TEMPERATURE: 260°C
Device Meets MSL 1 Requirements
ORDERING INFORMATION
MAXIMUM RATINGS
†
Device
Package
Shipping
Rating
Symbol
Max
Unit
MM5ZxxxxT1G
SOD−523
(Pb−Free)
3,000 /
Tape & Reel
Total Device Dissipation FR−5 Board,
P
D
300
mW
@ T = 25°C
A
SZMM5ZxxxT1G SOD−523
(Pb−Free)
3,000 /
Tape & Reel
Thermal Resistance,
R
390
°C/W
°C
q
JA
Junction−to−Ambient (Note 1)
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
Junction and Storage
Temperature Range
T , T
J
−65 to +150
stg
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
DEVICE MARKING INFORMATION
See specific marking information in the device marking
column of the Electrical Characteristics tables starting on
page 3 of this data sheet.
1. EIA/JEDEC51.3 board design and EIA/JEDEC51.2 still air test method
2
(25 mm , 2 oz., 3.8 mm plating).
*For additional information on our Pb−Free strategy and soldering details, please
download the ON Semiconductor Soldering and Mounting Techniques
Reference Manual, SOLDERRM/D.
©
Semiconductor Components Industries, LLC, 2013
1
Publication Order Number:
April, 2013 − Rev. 10
MM5Z2V4T1/D