F-213
MLE–120–01–G–DV
CLM–126–02–F–D
MLE–150–01–G–DV
TM
CLM–111–02–L–D
EXTENDED LIFE PRODUCT
(1,00 mm) .0394"
CLM, MLE SERIES
10 year Mixed Flowing Gas with 30µ" Gold
Call Samtec for maximum cycles
RUGGED RELIABLE MICRO SOCKETS
SPECIFICATIONS
PLATING
OPTION
NO. PINS
PER ROW
OPTIONS
CLM
02
D
1
For complete specifications and
recommended PCB layouts
see www.samtec.com?CLM
Mates with:
FTM, FTMH, MW
Insulator Material:
Black LCP
–F
Contact Material:
Phosphor Bronze
= Gold flash on
contact,
–BE
(Required for bottom entry)
02 thru 50
= Bottom Entry
Plating:
Au, Sn or SnPb
MatteTin on tail
over 50µ" (1,27 µm) Ni
Current Rating:
–L
–K
3A per contact
= 10µ" (0,25 µm)
Gold on contact,
MatteTin on tail
(5,72)
.225
x
= (3,50 mm) .138" DIA
Polyimide film Pick & Place Pad
(7 positions minimum)
@ 80°C ambient
Operating Temp Range:
-55°C to +125°C
(3,57)
.140
No. of positions x (1,00) .03937
+ (0,318) .0125
Contact Resistance:
15 mΩ
(1,00)
.03937 100
02
01
(2,41)
.095
–P
Insertion Depth:
(2,54)
.100
Top Entry = (1,40 mm) .055"
min., Bottom Entry = (2,41 mm)
.095" min. (Add board
thickness for correct post OAL)
Insertion Force:
= Pick & Place Pad
(7 positions minimum)
–P
(0,28)
(1,00)
.03937
(8,26) .325
by A
.011
–PA
(3,81)
.150
1.5 oz (0,42 N) average
Normal Force:
40 grams (0,39 N) average
Withdrawal Force:
.75 oz (0,21 N) average
Max Cycles:
100 with 10µ" (0,25 µm) Au
RoHS Compliant:
Yes
Lead-Free Solderable: Yes
SMT Lead Coplanarity:
(0,10 mm) .004" max (02-25)
(0,15 mm) .006" max (26-50)
= Pick & Place Pad with
integral Alignment Pin
(1,36)
.054
(3,00)
.118
(2,26)
.089
(2,12)
.084
–TR
(0,89) .035
DIA
= Tape & Reel Packaging
(7,00)
.275
APPLICATION
PIN/ROW
04-15
A
Note: Some
–PA
lengths, styles
and options are
non-standard,
non-returnable.
(3,56)
.140
APPLICATION
SPECIFIC OPTION
(7,11)
.280
16-50
• Alignment Pin available.
• Other Gold plating options available.
Pass-Thru
Call Samtec.
SPECIFICATIONS
For complete specifications and
recommended PCB layouts
see www.samtec.com?MLE
PLATING
OPTION
NO. PINS
PER ROW
OPTIONS
MLE
01
DV
1
Insulator Material:
Black LCP
Mates with:
FTM, FTMH, MW
–G
= 10µ"
(0,25 µm)
Gold
Contact Material:
BeCu
–A
02 thru 50
Operating Temp Range:
-55°C to +125°C
= Alignment Pin
(3 positions minimum)
Metal or plastic at Samtec
Plating:
Au over 10µ" (0,25 µm) Ni
Insertion Depth:
discretion.
(0,71)
(1,63 mm) .064" to (3,18 mm)
.125" with (0,38 mm) .015"
wipe, pass-through, or
(2,44 mm) .096" minimum
for bottom entry
.028
–K
No. of positions
x (1,00) .03937 + (0,20) .008
(0,64)
.025
DIA
= (4,00 mm) .1575" DIA
Polyimide film Pick & Place Pad
(5 positions minimum)
(1,00)
100
02
01
.03937
Insertion Force:
–A
2.70 oz (0,75 N) average
Withdrawal Force:
0.50 oz (0,14 N) average
RoHS Compliant: Yes
Lead-Free Solderable: Yes
SMT Lead Coplanarity:
(0,10 mm) .004" max (02-25)
(0,15 mm) .006" max (26-50)
(3,07)
.121
(6,35)
.250
x
(3,18)
.125
–P
= Metal Pick & Place Pad
(5 positions minimum)
(4,32)
.170
(0,30)
.012
(1,00)
.03937
(3,30)
.130
–TR
(3,50)
.138
(3,12)
.123
= Tape & Reel Packaging
Note: Some lengths, styles
and options are non-standard,
non-returnable.
–P
WWW.SAMTEC.COM