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MKE14F512VLL16 PDF预览

MKE14F512VLL16

更新时间: 2024-11-13 21:18:39
品牌 Logo 应用领域
恩智浦 - NXP 时钟外围集成电路
页数 文件大小 规格书
9页 406K
描述
RISC MICROCONTROLLER

MKE14F512VLL16 技术参数

是否Rohs认证: 符合生命周期:Active
包装说明:LQFP,Reach Compliance Code:compliant
ECCN代码:3A991.A.2HTS代码:8542.31.00.01
风险等级:2.29具有ADC:YES
地址总线宽度:位大小:32
最大时钟频率:50 MHzDMA 通道:YES
外部数据总线宽度:长度:14 mm
湿度敏感等级:3I/O 线路数量:89
端子数量:100PWM 通道:YES
封装代码:LQFP封装形状:SQUARE
封装形式:FLATPACK, LOW PROFILE峰值回流温度(摄氏度):NOT SPECIFIED
速度:168 MHz最大供电电压:5.5 V
最小供电电压:2.7 V标称供电电压:5 V
表面贴装:YES技术:CMOS
端子形式:GULL WING端子节距:0.5 mm
端子位置:QUAD处于峰值回流温度下的最长时间:NOT SPECIFIED
宽度:14 mmuPs/uCs/外围集成电路类型:MICROCONTROLLER, RISC
Base Number Matches:1

MKE14F512VLL16 数据手册

 浏览型号MKE14F512VLL16的Datasheet PDF文件第2页浏览型号MKE14F512VLL16的Datasheet PDF文件第3页浏览型号MKE14F512VLL16的Datasheet PDF文件第4页浏览型号MKE14F512VLL16的Datasheet PDF文件第5页浏览型号MKE14F512VLL16的Datasheet PDF文件第6页浏览型号MKE14F512VLL16的Datasheet PDF文件第7页 
NXP Semiconductors  
Document Number: KE1XF512PB  
Rev. 1.1, 08/2016  
Product Brief  
Kinetis KE1xF512 MCUs  
Robust 5V MCUs with ADCs, FlexTimers, CAN and expanding  
memory integration in Kinetis E-series. Now up to 512 KB flash  
and 64 KB SRAM.  
Contents  
1. Kinetis E family introduction  
The Kinetis E family provides a highly scalable  
1. Kinetis E family introduction............................................. 1  
2. Kinetis KE1xF sub-family overview ................................. 2  
3. Kinetis KE1xF key product features.................................. 2  
4. Kinetis KE1xF product family feature summary ............... 3  
5. Kinetis KE1xF family block diagram ................................ 4  
6. Kinetis KE1xF product family features ............................. 5  
portfolio for robust 5V MCUs, with cores ranging  
from 20 MHz ARM® Cortex®-M0+ MCUs to 168  
MHz ARM® Cortex®-M4 MCUs. With 2.7V ~ 5.5V  
7. Comprehensive enablement solutions................................ 6  
supply and focus on exceptional EMC/ESD  
robustness, the Kinetis E family is well-suited for a  
wide range of applications in electrical harsh  
7.1. Kinetis Software Development Kit (SDK) ................ 6  
7.2. Integrated Development Environments (IDE) ........... 6  
7.3. Online enablement with ARM mbed™ development  
platform ..................................................................... 6  
7.4. Boot-loader................................................................ 6  
7.5. Development hardware.............................................. 6  
environments, and is optimized for cost-sensitive  
applications. The Kinetis E family offers a broad range  
of memory, peripherals, and package options.  
8. Part identification............................................................... 7  
8.1. Description ................................................................ 7  
8.2. Format ....................................................................... 7  
8.3. Fields......................................................................... 7  
9. Orderable part numbers ..................................................... 8  
10. Revision history................................................................. 8  
© 2016 NXP B.V.  
 

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