是否无铅: | 不含铅 | 是否Rohs认证: | 符合 |
生命周期: | Active | 包装说明: | LFBGA-144 |
Reach Compliance Code: | compliant | Factory Lead Time: | 14 weeks |
风险等级: | 5.74 | 地址总线宽度: | 16 |
边界扫描: | YES | 总线兼容性: | I2C; LPC; PCI; SPI |
通信协议: | ASYNC, BIT, BYTE, UART | 最大数据传输速率: | 0.25 MBps |
外部数据总线宽度: | 32 | JESD-30 代码: | S-PBGA-B144 |
长度: | 7 mm | 低功率模式: | YES |
DMA 通道数量: | 8 | I/O 线路数量: | 115 |
串行 I/O 数: | 8 | 端子数量: | 144 |
最高工作温度: | 85 °C | 最低工作温度: | -40 °C |
封装主体材料: | PLASTIC/EPOXY | 封装代码: | TFBGA |
封装等效代码: | BGA144,13x13,20 | 封装形状: | SQUARE |
封装形式: | GRID ARRAY, THIN PROFILE, FINE PITCH | 筛选级别: | TS 16949 |
座面最大高度: | 1.2 mm | 最大压摆率: | 29 mA |
最大供电电压: | 3.63 V | 最小供电电压: | 2.97 V |
标称供电电压: | 3.3 V | 表面贴装: | YES |
技术: | CMOS | 温度等级: | INDUSTRIAL |
端子形式: | BALL | 端子节距: | 0.5 mm |
端子位置: | BOTTOM | 宽度: | 7 mm |
uPs/uCs/外围集成电路类型: | SERIAL IO/COMMUNICATION CONTROLLER, SERIAL | Base Number Matches: | 1 |
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