MCP616/7/8/9
TEMPERATURE CHARACTERISTICS
Electrical Specifications: Unless otherwise indicated, VDD = +2.3V to +5.5V and VSS = GND.
Parameters
Sym
Min
Typ
Max
Units
Conditions
Temperature Ranges
Specified Temperature Range
Operating Temperature Range
Storage Temperature Range
Thermal Package Resistances
Thermal Resistance, 8L-MSOP
Thermal Resistance, 8L-PDIP
Thermal Resistance, 8L-SOIC
Thermal Resistance, 14L-PDIP
Thermal Resistance, 14L-SOIC
Thermal Resistance, 14L-TSSOP
TA
TA
TA
-40
-40
-65
—
—
—
+85
+125
+150
°C
°C
°C
Note 1
θJA
θJA
θJA
θJA
θJA
θJA
—
—
—
—
—
—
211
89.3
149.5
70
—
—
—
—
—
—
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
95.3
100
Note 1: The MCP616/7/8/9 operate over this extended temperature range, but with reduced performance. In any case, the
Junction Temperature (TJ) must not exceed the Absolute Maximum specification of +150°C.
1.1
Test Circuits
The test circuits used for the DC and AC tests are
shown in Figure 1-2 and Figure 1-3. The bypass
capacitors are laid out according to the rules discussed
in Section 4.6 “Supply Bypass”.
VDD
1 µF
0.1 µF
VIN
VOUT
RL
RN
RG
MCP61X
CL
RF
VDD/2
VL
FIGURE 1-2:
AC and DC Test Circuit for
Most Non-Inverting Gain Conditions.
VDD
1 µF
0.1 µF
VDD/2
VOUT
RL
RN
RG
MCP61X
CL
RF
VIN
VL
FIGURE 1-3:
AC and DC Test Circuit for
Most Inverting Gain Conditions.
© 2008 Microchip Technology Inc.
DS21613C-page 5