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MCM69R736CZP5R PDF预览

MCM69R736CZP5R

更新时间: 2024-02-09 03:13:32
品牌 Logo 应用领域
飞思卡尔 - FREESCALE 内存集成电路静态存储器信息通信管理
页数 文件大小 规格书
20页 520K
描述
4M Late Write HSTL

MCM69R736CZP5R 技术参数

是否Rohs认证:不符合生命周期:Transferred
零件包装代码:BGA包装说明:BGA, BGA119,7X17,50
针数:119Reach Compliance Code:unknown
风险等级:5.54Is Samacsys:N
最长访问时间:2.5 nsI/O 类型:COMMON
JESD-30 代码:S-PBGA-B119长度:22 mm
内存密度:4718592 bit内存集成电路类型:LATE-WRITE SRAM
内存宽度:36湿度敏感等级:1
功能数量:1端子数量:119
字数:131072 words字数代码:128000
工作模式:SYNCHRONOUS最高工作温度:70 °C
最低工作温度:组织:128KX36
输出特性:3-STATE封装主体材料:PLASTIC/EPOXY
封装代码:BGA封装等效代码:BGA119,7X17,50
封装形状:SQUARE封装形式:GRID ARRAY
并行/串行:PARALLEL峰值回流温度(摄氏度):225
电源:1.5,3.3 V认证状态:Not Qualified
座面最大高度:2.4 mm最大待机电流:0.1 A
最小待机电流:3.15 V子类别:SRAMs
最大压摆率:0.75 mA最大供电电压 (Vsup):3.465 V
最小供电电压 (Vsup):3.135 V标称供电电压 (Vsup):3.3 V
表面贴装:YES技术:BICMOS
温度等级:COMMERCIAL端子形式:BALL
端子节距:1.27 mm端子位置:BOTTOM
处于峰值回流温度下的最长时间:NOT SPECIFIED宽度:14 mm
Base Number Matches:1

MCM69R736CZP5R 数据手册

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Freescale Semiconductor, Inc.  
SEMICONDUCTOR TECHNICAL DATA  
MOTOROLA  
Order this document  
by MCM69R736C/D  
MCM69R736C  
MCM69R818C  
4M Late Write HSTL  
The MCM69R736C/818C is a 4M–bit synchronous late write fast static RAM  
designed to provide high performance in secondary cache and ATM switch,  
Telecom, and other high speed memory applications. The MCM69R818C  
(organizedas256Kwordsby18bits)andtheMCM69R736C(organizedas128K  
words by 36 bits) are fabricated in Motorola’s high performance silicon gate  
BiCMOS technology.  
The differential clock (CK) inputs control the timing of read/write operations of  
theRAM. AttherisingedgeofCK, alladdresses, writeenables, andsynchronous  
selects are registered. An internal buffer and special logic enable the memory to  
accept write data on the rising edge of CK, a cycle after address and control sig-  
nals. Read data is also driven on the rising edge of CK.  
ZP PACKAGE  
PBGA  
CASE 999–02  
The RAM uses HSTL inputs and outputs. The adjustable input trip–point  
(V ) and output voltage (V  
) gives the system designer greater flexibility in  
ref  
DDQ  
optimizing system performance.  
The synchronous write and byte enables allow writing to individual bytes or  
the entire word.  
The impedance of the output buffers is programmable, allowing the outputs to  
match the impedance of the circuit traces which reduces signal reflections.  
Byte Write Control  
Single 3.3 V +10%, –5% Operation  
HSTL — I/O (JEDEC Standard JESD8–6 Class I Compatible)  
HSTL — User Selectable Input Trip–Point  
HSTL — Compatible Programmable Impedance Output Drivers  
Register to Register Synchronous Operation  
Asynchronous Output Enable  
Boundary Scan (JTAG) IEEE 1149.1 Compatible  
Differential Clock Inputs  
Optional x18 or x36 Organization  
MCM69R736C/818C–4 = 4 ns  
MCM69R736C/818C–4.4 = 4.4 ns  
MCM69R736C/818C–5 = 5 ns  
MCM69R736C/818C–6 = 6 ns  
Sleep Mode Operation (ZZ pin)  
119–Bump, 50 mil (1.27 mm) Pitch, 14 mm x 22 mm Plastic Ball Grid Array  
(PBGA) Package  
REV 1  
8/10/99  
Motorola, Inc. 1999  
For More Information On This Product,  
Go to: www.freescale.com  

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