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| 型号 | 品牌 | 获取价格 | 描述 | 数据表 |
| MCM64AF32 | MOTOROLA |
获取价格 |
256K Asynchronous Secondary Cache Module for Pentium |
|
| MCM64AF32SG15 | MOTOROLA |
获取价格 |
256K Asynchronous Secondary Cache Module for Pentium |
|
| MCM64E836FC3.0 | NXP |
获取价格 |
256KX36 DDR SRAM, PBGA153, 14 X 22 MM, 1.27 MM PITCH, PLASTIC, FLIP CHIP, BGA-153 |
|
| MCM64E836FC3.0 | MOTOROLA |
获取价格 |
256KX36 DDR SRAM, 0.2ns, PBGA153, 14 X 22 MM, 1.27 MM PITCH, PLASTIC, FLIP CHIP, BGA-153 |
|
| MCM64E836FC3.0R | NXP |
获取价格 |
IC,SYNC SRAM,SDR/DDR,256KX36,CMOS,BGA,153PIN,PLASTIC |
|
| MCM64E836FC3.3 | MOTOROLA |
获取价格 |
DDR SRAM, 256KX36, 0.2ns, CMOS, PBGA153, 14 X 22 MM, 1.27 MM PITCH, PLASTIC, FLIP CHIP, BG |
|
| MCM64E836FC3.3R | NXP |
获取价格 |
256KX36 DDR SRAM, PBGA153, 14 X 22 MM, 1.27 MM PITCH, PLASTIC, FLIP CHIP, BGA-153 |
|
| MCM64E836FC3.3R | MOTOROLA |
获取价格 |
256KX36 DDR SRAM, 0.2ns, PBGA153, 14 X 22 MM, 1.27 MM PITCH, PLASTIC, FLIP CHIP, BGA-153 |
|
| MCM64E836FC4.0 | NXP |
获取价格 |
256KX36 DDR SRAM, PBGA153, 14 X 22 MM, 1.27 MM PITCH, PLASTIC, FLIP CHIP, BGA-153 |
|
| MCM64E836FC4.0R | NXP |
获取价格 |
IC,SYNC SRAM,SDR/DDR,256KX36,CMOS,BGA,153PIN,PLASTIC |
|
解析光耦仿真器：升级光耦合器技术的必要性
英伟达新一代Blackwell GPU过热问题致交付延迟
国产厂商思特威CMOS图像传感器芯片单月出货超1亿颗，技术创新引领行业发展
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