5秒后页面跳转
捷配首页

Datasheet > MCM64E836RS5.0
MCM64E836RS5.0 PDF预览

MCM64E836RS5.0

更新时间： 2024-11-20 14:53:15
品牌 Logo 应用领域
摩托罗拉 - MOTOROLA 双倍数据速率静态存储器内存集成电路
页数 文件大小 规格书
24页 503K
描述
256KX36 DDR SRAM, 0.2ns, CBGA153, 14 X 22 MM, 1.27 MM PITCH, CERAMIC, FLIP CHIP, BGA-153

阅读下载

中文翻译

获取价格

MCM64E836RS5.0 技术参数

生命周期：Obsolete零件包装代码：BGA
包装说明：BGA,针数：153
Reach Compliance Code：unknownECCN代码：3A991.B.2.A
HTS代码：8542.32.00.41风险等级：5.79
最长访问时间：0.2 nsJESD-30 代码：R-CBGA-B153
长度：22 mm内存密度：9437184 bit
内存集成电路类型：DDR SRAM内存宽度：36
功能数量：1端子数量：153
字数：262144 words字数代码：256000
工作模式：SYNCHRONOUS最高工作温度：70 °C
最低工作温度：组织：256KX36
封装主体材料：CERAMIC, METAL-SEALED COFIRED封装代码：BGA
封装形状：RECTANGULAR封装形式：GRID ARRAY
并行/串行：PARALLEL认证状态：Not Qualified
座面最大高度：3.02 mm最大供电电压 (Vsup)：2.625 V
最小供电电压 (Vsup)：2.375 V标称供电电压 (Vsup)：2.5 V
表面贴装：YES技术：CMOS
温度等级：COMMERCIAL端子形式：BALL
端子节距：1.27 mm端子位置：BOTTOM
宽度：14 mmBase Number Matches：1

MCM64E836RS5.0 数据手册

 浏览型号MCM64E836RS5.0的Datasheet PDF文件第2页浏览型号MCM64E836RS5.0的Datasheet PDF文件第3页浏览型号MCM64E836RS5.0的Datasheet PDF文件第4页浏览型号MCM64E836RS5.0的Datasheet PDF文件第5页浏览型号MCM64E836RS5.0的Datasheet PDF文件第6页浏览型号MCM64E836RS5.0的Datasheet PDF文件第7页 
Order this document  
by MC64E918/D  
SEMICONDUCTOR TECHNICAL DATA  
MCM64E918  
MCM64E836  
Product Preview  
8MB Double Data Rate HSTL I/O  
Fast SRAM  
The MCM64E918/MCM64E836 are 8M–bit pipelined burst synchronous late  
writefaststaticRAMsdesignedtoprovideveryhighdatabandwidthinsecondary  
cache applications. The MCM64E918 (organized as 512K words by 18 bits wide)  
and the MCM64E836 (organized as 256K words by 36 bits wide) are fabricated  
in Motorola’s high performance silicon gate MOS technology.  
The differential clock (CK) inputs control the timing of read/write operations of  
the RAM. At the rising edge of CK, all addresses and burst control inputs are  
registered. An internal buffer and special logic enables the memory to accept  
write data on the rising or rising and falling edges of the clock, a cycle following  
address and control signals. Read data is driven on the rising or rising and falling  
edges of the CK clock and is referenced to echo clock (CQ and CQ) outputs.  
The MCM64E918/MCM64E836 have HSTL inputs and outputs. The adjust-  
FC PACKAGE  
FLIPPED CHIP PBGA  
CASE 1107A–01  
RS PACKAGE  
FLIPPED CHIP CBGA  
CASE 1107B–01  
able input trip–point (V ) and output power supply voltage (V  
) gives  
ref  
DDQ  
the system designer greater flexibility in optimizing system performance.  
The impedance of the output buffers is programmable, allowing the outputs to  
match the impedance of the circuit traces, which reduces signal reflections.  
•
•
Single 2.5 V ± 5% Power Supply  
Single Data Rate (SDR) and Double Data Rate (DDR) Burst Read and  
Write  
•
•
•
•
•
Pin Selectable Linear or Interleaved Burst Order  
Four Tick Burst with Automatic Wrap–Around  
Differential Clock Inputs  
Active High and Active Low Echo Clock Outputs  
1.8 V Expanded HSTL — I/O (JEDEC Standard JESD8–6 Class I  
Compatible)  
•
1.8 V Expanded HSTL — Compatible Programmable Impedance Output  
Drivers  
•
•
•
•
•
Pipelined (Register to Register) Synchronous Operation  
Boundary Scan (JTAG) IEEE 1149.1 Compatible  
Stop Clock Functionality Supported  
Optional x18 or x36 Organization  
MCM64E918/MCM64E836–3.0 = 3.0 ns Clock Cycle Time  
MCM64E918/MCM64E836–3.3 = 3.3 ns Clock Cycle Time  
MCM64E918/MCM64E836–4.0 = 4.0 ns Clock Cycle Time  
MCM64E918/MCM64E836–4.4 = 4.4 ns Clock Cycle Time  
MCM64E918/MCM64E836–5.0 = 5.0 ns Clock Cycle Time  
9 x 17 (153) Bump, 50 mil (1.27 mm) Pitch, 14 mm x 22 mm Flipped Chip  
Plastic Ball Grid Array (PBGA) or Flipped Chip Ceramic Ball Grid Array  
(CBGA) Packages  
•
This document contains information on a product under development. Motorola reserves the right to change or discontinue this product without notice.  
8/25/99  
Motorola, Inc. 1999  
1234567...24

中文翻译

下载PDF

与MCM64E836RS5.0相关器件

型号 品牌 获取价格 描述 数据表
MCM64E836RS5.0R MOTOROLA

获取价格

 		256KX36 DDR SRAM, 0.2ns, CBGA153, 14 X 22 MM, 1.27 MM PITCH, CERAMIC, FLIP CHIP, BGA-153
MCM64E918FC3.0 NXP

获取价格

 		512KX18 DDR SRAM, PBGA153, 14 X 22 MM, 1.27 MM PITCH, PLASTIC, FLIP CHIP, BGA-153
MCM64E918FC3.0R NXP

获取价格

 		512KX18 DDR SRAM, PBGA153, 14 X 22 MM, 1.27 MM PITCH, PLASTIC, FLIP CHIP, BGA-153
MCM64E918FC3.0R MOTOROLA

获取价格

 		512KX18 DDR SRAM, 0.2ns, PBGA153, 14 X 22 MM, 1.27 MM PITCH, PLASTIC, FLIP CHIP, BGA-153
MCM64E918FC3.3 MOTOROLA

获取价格

 		512KX18 DDR SRAM, 0.2ns, PBGA153, 14 X 22 MM, 1.27 MM PITCH, PLASTIC, FLIP CHIP, BGA-153
MCM64E918FC3.3R NXP

获取价格

 		IC,SYNC SRAM,SDR/DDR,512KX18,CMOS,BGA,153PIN,PLASTIC
MCM64E918FC4.0 NXP

获取价格

 		IC,SYNC SRAM,SDR/DDR,512KX18,CMOS,BGA,153PIN,PLASTIC
MCM64E918FC4.0 MOTOROLA

获取价格

 		512KX18 DDR SRAM, 0.2ns, PBGA153, 14 X 22 MM, 1.27 MM PITCH, PLASTIC, FLIP CHIP, BGA-153
MCM64E918FC4.0R NXP

获取价格

 		512KX18 DDR SRAM, PBGA153, 14 X 22 MM, 1.27 MM PITCH, PLASTIC, FLIP CHIP, BGA-153
MCM64E918FC4.4 MOTOROLA

获取价格

 		512KX18 DDR SRAM, 0.2ns, PBGA153, 14 X 22 MM, 1.27 MM PITCH, PLASTIC, FLIP CHIP, BGA-153

与MCM64E836RS5.0相关文章

您还可以找


热门产品
PCB打样/小批量
铝基板
BOM智能配单
PCBA制造
钣金
精密CNC
模具注塑
薄膜开关
精选活动
PCBA打样特惠
四六层板品质升级
铝基板品质升级
一体化电子制造
DFM下载
服务支持
企业认证
产品展示
工厂展示
工艺能力
积分商城
关于捷配
捷配简介
企业文化
公司动态
人才招聘
联系我们
帮助中心
下单流程
付款流程
开票流程
常见问题
全球PCB制造服务专线 400-613-0088

工作时间：9:00-21:00

CEO邮箱：ceo@jiepei.com

投诉邮箱：tousu@jiepei.com

捷配网-微信公众号 微信公众号
捷配网-微信公众号 抖音公众号
资质认证：
合作快递：
支付方式：
Copyright © 2024 Jiepei.com Inc. All Rights Reserved. 版权所有:杭州捷配信息科技有限公司 浙公网安备 33010502006866号 浙ICP备10014259号-119 营业执照ICP证