Datasheet > MCM64E836FC3.3R

MCM64E836FC3.3R

更新时间： 2024-11-24 19:07:59

品牌	Logo	应用领域
恩智浦 - NXP		时钟双倍数据速率静态存储器内存集成电路
页数	文件大小	规格书
22页	424K
描述
256KX36 DDR SRAM, PBGA153, 14 X 22 MM, 1.27 MM PITCH, PLASTIC, FLIP CHIP, BGA-153

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MCM64E836FC3.3R 技术参数

生命周期：	Transferred	零件包装代码：	BGA
包装说明：	BGA,	针数：	153
Reach Compliance Code：	unknown	风险等级：	5.66
Is Samacsys：	N	其他特性：	PIPELINED ARCHITECTURE
JESD-30 代码：	R-PBGA-B153	长度：	22 mm
内存密度：	9437184 bit	内存集成电路类型：	DDR SRAM
内存宽度：	36	功能数量：	1
端子数量：	153	字数：	262144 words
字数代码：	256000	工作模式：	SYNCHRONOUS
最高工作温度：	70 °C	最低工作温度：
组织：	256KX36	封装主体材料：	PLASTIC/EPOXY
封装代码：	BGA	封装形状：	RECTANGULAR
封装形式：	GRID ARRAY	并行/串行：	PARALLEL
认证状态：	Not Qualified	座面最大高度：	2.77 mm
最大供电电压 (Vsup)：	2.625 V	最小供电电压 (Vsup)：	2.375 V
标称供电电压 (Vsup)：	2.5 V	表面贴装：	YES
技术：	CMOS	温度等级：	COMMERCIAL
端子形式：	BALL	端子节距：	1.27 mm
端子位置：	BOTTOM	宽度：	14 mm
Base Number Matches：	1

MCM64E836FC3.3R 数据手册

Freescale Semiconductor, Inc.

SEMICONDUCTOR TECHNICAL DATA

MOTOROLA

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by MCM64E918/D

MCM64E918

MCM64E836

8MB Double Data Rate HSTL I/O

Fast SRAM

The MCM64E918/MCM64E836 are 8M–bit pipelined burst synchronous late

write fast static RAMs designed to provide very high data bandwidth in secondary

cache applications. The MCM64E918 (organized as 512K words by 18 bits wide)

and the MCM64E836 (organized as 256K words by 36 bits wide) are fabricated

in Motorola’s high performance silicon gate MOS technology.

The differential clock (CK) inputs control the timing of read/write operations of

the RAM. At the rising edge of CK, all addresses and burst control inputs are reg-

istered. An internal buffer and special logic enables the memory to accept write

data on the rising or rising and falling edges of the clock, a cycle following address

and control signals. Read data is driven on the rising or rising and falling edges

of the CK clock and is referenced to echo clock (CQ and CQ) outputs.

The MCM64E918/MCM64E836 have HSTL inputs and outputs. The adjust-

able input trip–point (V_ref) and output power supply voltage (V_DDQ) gives

the system designer greater flexibility in optimizing system performance.

The impedance of the output buffers is programmable, allowing the outputs to

match the impedance of the circuit traces, which reduces signal reflections.

FC PACKAGE

FLIPPED CHIP PBGA

CASE 1107C–03

• Single 2.5 V 5% Power Supply

• Single Data Rate (SDR) and Double Data Rate (DDR) Burst Read and

Write

• Pin Selectable Linear or Interleaved Burst Order

• Four Tick Burst with Automatic Wrap–Around

• Differential Clock Inputs

• Active High and Active Low Echo Clock Outputs

• 1.8 V Expanded HSTL — I/O (JEDEC Standard JESD8–6 Class I

Compatible)

• 1.8 V Expanded HSTL — Compatible Programmable Impedance Output

Drivers

• Pipelined (Register to Register) Synchronous Operation

• Boundary Scan (JTAG) IEEE 1149.1 Compatible

• Stop Clock Functionality Supported

• Optional x18 or x36 Organization

• MCM64E918/MCM64E836–3.0 = 3.0 ns Clock Cycle Time

MCM64E918/MCM64E836–3.3 = 3.3 ns Clock Cycle Time

MCM64E918/MCM64E836–4.0 = 4.0 ns Clock Cycle Time

• 9 x 17 (153) Bump, 50 mil (1.27 mm) Pitch, 14 mm x 22 mm Flipped Chip

Plastic Ball Grid Array (PBGA) package

REV2

7/2/01

 Motorola, Inc. 2001

MOTOROLA FAST SRAM

MCM64E918•MCM64E836

For More Information On This Product,

Go to: www.freescale.com

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与MCM64E836FC3.3R相关器件

型号	品牌	获取价格	描述	数据表
MCM64E836FC4.0	NXP	获取价格	256KX36 DDR SRAM, PBGA153, 14 X 22 MM, 1.27 MM PITCH, PLASTIC, FLIP CHIP, BGA-153
MCM64E836FC4.0R	NXP	获取价格	IC,SYNC SRAM,SDR/DDR,256KX36,CMOS,BGA,153PIN,PLASTIC
MCM64E836FC4.4	MOTOROLA	获取价格	DDR SRAM, 256KX36, 0.2ns, CMOS, PBGA153, 14 X 22 MM, 1.27 MM PITCH, PLASTIC, FLIP CHIP, BG
MCM64E836FC5.0	MOTOROLA	获取价格	256KX36 DDR SRAM, 0.2ns, PBGA153, 14 X 22 MM, 1.27 MM PITCH, PLASTIC, FLIP CHIP, BGA-153
MCM64E836FC5.0R	MOTOROLA	获取价格	256KX36 DDR SRAM, 0.2ns, PBGA153, 14 X 22 MM, 1.27 MM PITCH, PLASTIC, FLIP CHIP, BGA-153
MCM64E836RS3.0	MOTOROLA	获取价格	DDR SRAM, 256KX36, 0.2ns, CMOS, CBGA153, 14 X 22 MM, 1.27 MM PITCH, CERAMIC, FLIP CHIP, BG
MCM64E836RS3.0R	MOTOROLA	获取价格	256KX36 DDR SRAM, 0.2ns, CBGA153, 14 X 22 MM, 1.27 MM PITCH, CERAMIC, FLIP CHIP, BGA-153
MCM64E836RS3.3	MOTOROLA	获取价格	256KX36 DDR SRAM, 0.2ns, CBGA153, 14 X 22 MM, 1.27 MM PITCH, CERAMIC, FLIP CHIP, BGA-153
MCM64E836RS3.3R	MOTOROLA	获取价格	256KX36 DDR SRAM, 0.2ns, CBGA153, 14 X 22 MM, 1.27 MM PITCH, CERAMIC, FLIP CHIP, BGA-153
MCM64E836RS4.4	MOTOROLA	获取价格	DDR SRAM, 256KX36, 0.2ns, CMOS, CBGA153, 14 X 22 MM, 1.27 MM PITCH, CERAMIC, FLIP CHIP, BG

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