MCAC130N04
Features
•
•
•
•
•
•
Split Gate Trench MOSFET Technology
High Density Cell Design for Low RDS(on)
Moisture Sensitivity Level 1
Halogen Free. “Green” Device (Note 1)
Epoxy Meets UL 94 V-0 Flammability Rating
N-CHANNEL
MOSFET
Lead Free Finish/RoHS Compliant ("P" Suffix Designates RoHS
Compliant. See Ordering Information)
Maximum Ratings
•
•
Operating Junction Temperature Range : -55°C to +150°C
Storage Temperature Range: -55°C to +150°C
DFN5060
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•
Thermal Resistance: 50°C/W Junction to Ambient(Note 2)
Thermal Resistance: 1.08°C/W Junction to Case
Parameter
Rating
40
Symbol
VDS
Unit
V
D
H
Drain-Source Voltage
Gate-Source Volltage
B
A
N
VGS
±20
V
•
PIN 1
TC=25℃
130
82
G
C
J
ID
A
Continuous Drain Current
Pulsed Drain Current (Note 3)
TC=100℃
E
IDM
PD
520
115
600
A
W
F
Total Power Dissipation (Note 4)
K
Single Pulse Avalanche Energy (Note 5)
EAS
mJ
M
L
Note:
1. Halogen free "Green” products are defined as those which contain
<900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and
<1000ppm antimony compounds.
2. The value of RθJA is measured with the device mounted on 1in2 FR-4
board with 2oz. Copper, in a still air environment with TA =25°C. The
value in any given application depends on the user's specifi3023c
board design.
3. Repetitive rating; pulse width limited by max. junction temperature.
4. PD is based on max. junction temperature, using Steady-State
junction-ambient thermal resistance.
DIMENSIONS
MM
MIN MAX MIN MAX
0.031 0.047 0.80 1.20
INCHES
DIM
NOTE
TYP.
A
B
C
D
E
F
G
H
K
J
0.010
0.254
0.193 0.222 4.90 5.64
0.232 0.250 5.90 6.35
0.148 0.167 3.75 4.25
0.126 0.154 3.20 3.92
0.189 0.213 4.80 5.40
0.222 0.239 5.65 6.06
0.045 0.059 1.15 1.50
0.012 0.020 0.30 0.50
0.046 0.054 1.17 1.37
0.012 0.028 0.30 0.71
0.016 0.028 0.40 0.71
5. TJ=25, VDD=30V, VGS=10V, L=3mH.
Internal Structure and Marking Code
8
7
6
5
D
D
D
D
8
7
6
5
L
M
N
MCC
MCAC130N04
1
2
3
4
S
S
S
G
1
2
3
4
Rev.4-1-06032023
1/6
MCCSEMI.COM