MCAC40P03
Features
•
Trench MOSFET Technology
•
•
•
•
•
High Density Cell Design for Low RDS(ON)
Moisture Sensitivity Level 1
Halogen Free. “Green” Device (Note 1)
Epoxy Meets UL 94 V-0 Flammability Rating
P-CHANNEL
Lead Free Finish/RoHS Compliant ("P" Suffix Designates RoHS
Compliant. See Ordering Information)
MOSFET
•
Maximum Ratings
•
•
Operating Junction Temperature Range : -55°C to +150°C
Storage Temperature Range: -55°C to +150°C
•
•
Thermal Resistance: 50°C/W Junction to Ambient (Note 2)
Thermal Resistance: 2.3°C/W Junction to Case
Parameter
Rating
-30
DFN5060
Symbol
VDS
Unit
V
Drain-Source Voltage
Gate-Source Volltage
VGS
±20
-40
V
TC=25℃
Continuous Drain Current
Pulsed Drain Current (Note 3)
A
ID
D
H
-25
TC=100℃
B
A
N
IDM
PD
-160
54
A
W
•
PIN 1
Total Power Dissipation(Note 4)
Single Pulsed Avalanche Energy(Note 5)
G
J
C
EAS
180
mJ
E
Note:
F
Halogen free "Green” products are defined as those which contain <900ppm bromine,
<900ppm chlorine (<1500ppm total Br + Cl) and <1000ppm antimony compounds. The
value of RθJA is measured with the device mounted on 1in2 FR-4 board with 2oz.
Copper, in a still air environment with TA =25°C.
1.
2.
K
M
L
3. Repetitive rating; pulse width limited by max. junction temperature.
4. PD is based on max. junction temperature, using junction-case thermal resistance.
5. TJ=25℃, VDD=-50V, VGS=-10V,RG=25Ω, L=1mH.
DIMENSIONS
MM
MIN MAX MIN MAX
0.031 0.047 0.80 1.20
Internal Structure and Marking Code
INCHES
DIM
NOTE
TYP.
A
B
C
D
E
F
G
H
K
J
0.010
0.254
8
7
6
5
D
D
D
D
0.193 0.222 4.90 5.64
0.232 0.250 5.90 6.35
0.148 0.167 3.75 4.25
0.126 0.154 3.20 3.92
0.189 0.213 4.80 5.40
0.222 0.239 5.65 6.06
0.045 0.059 1.15 1.50
0.012 0.020 0.30 0.50
0.046 0.054 1.17 1.37
0.012 0.028 0.30 0.71
0.016 0.028 0.40 0.71
8
7
6
5
MCC
MCAC40P03
1
2
3
4
S
S
S
G
L
M
N
1
2
3
4
Rev.4-1-01312024
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