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MC74HC112ANG PDF预览

MC74HC112ANG

更新时间: 2024-11-21 11:07:59
品牌 Logo 应用领域
安森美 - ONSEMI 触发器
页数 文件大小 规格书
8页 171K
描述
Dual J-K Flip-Flop with Set and Reset High−Performance Silicon−Gate CMOS

MC74HC112ANG 技术参数

是否Rohs认证: 符合生命周期:Obsolete
零件包装代码:DIP包装说明:DIP, DIP16,.3
针数:16Reach Compliance Code:compliant
HTS代码:8542.39.00.01风险等级:5.64
系列:HC/UHJESD-30 代码:R-PDIP-T16
长度:19.175 mm负载电容(CL):50 pF
逻辑集成电路类型:J-K FLIP-FLOP最大频率@ Nom-Sup:20000000 Hz
最大I(ol):0.004 A位数:2
功能数量:2端子数量:16
最高工作温度:125 °C最低工作温度:-55 °C
输出极性:COMPLEMENTARY封装主体材料:PLASTIC/EPOXY
封装代码:DIP封装等效代码:DIP16,.3
封装形状:RECTANGULAR封装形式:IN-LINE
包装方法:RAIL电源:2/6 V
认证状态:Not Qualified座面最大高度:4.44 mm
子类别:FF/Latches最大供电电压 (Vsup):6 V
最小供电电压 (Vsup):2 V标称供电电压 (Vsup):5 V
表面贴装:NO技术:CMOS
温度等级:MILITARY端子形式:THROUGH-HOLE
端子节距:2.54 mm端子位置:DUAL
触发器类型:NEGATIVE EDGE宽度:7.62 mm
Base Number Matches:1

MC74HC112ANG 数据手册

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MC74HC112A  
Dual J-K Flip-Flop with  
Set and Reset  
HighPerformance SiliconGate CMOS  
The MC74HC112A is identical in pinout to the LS112. The device  
inputs are compatible with standard CMOS outputs; with pullup  
resistors, they are compatible with LSTTL outputs.  
Each flipflop is negativeedge clocked and has activelow  
asynchronous Set and Reset inputs.  
http://onsemi.com  
MARKING  
DIAGRAMS  
16  
The HC112A is identical in function to the HC76, but has a different  
pinout.  
PDIP16  
N SUFFIX  
CASE 648  
MC74HC112AN  
AWLYYWWG  
16  
16  
Features  
1
Output Drive Capability: 10 LSTTL Loads  
Outputs Directly Interface to CMOS, NMOS, and TTL  
Operating Voltage Range: 2.0 to 6.0 V  
Low Input Current: 1.0 mA  
High Noise Immunity Characteristic of CMOS Devices  
In Compliance with the Requirements Defined by JEDEC Standard  
No. 7A  
1
16  
SOIC16  
D SUFFIX  
CASE 751B  
HC112AG  
AWLYWW  
1
1
16  
Similar in Function to the LS112 Except When Set and Reset are  
Low Simultaneously  
Chip Complexity: 100 FETs or 25 Equivalent Gates  
PbFree Packages are Available*  
TSSOP16  
DT SUFFIX  
CASE 948F  
HC  
112A  
ALYWG  
G
16  
1
1
16  
1
SOEIAJ16  
F SUFFIX  
CASE 966  
16  
74HC112A  
ALYWG  
1
A
L, WL  
Y, YY  
= Assembly Location  
= Wafer Lot  
= Year  
W, WW = Work Week  
G
G
= PbFree Package  
= PbFree Package  
(Note: Microdot may be in either location)  
ORDERING INFORMATION  
See detailed ordering and shipping information in the package  
dimensions section on page 2 of this data sheet.  
*For additional information on our PbFree strategy and soldering details, please  
download the ON Semiconductor Soldering and Mounting Techniques  
Reference Manual, SOLDERRM/D.  
© Semiconductor Components Industries, LLC, 2009  
1
Publication Order Number:  
December, 2009 Rev. 7  
MC74HC112/D  

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