是否Rohs认证: | 不符合 | 生命周期: | Transferred |
包装说明: | PGA, PGA100M,13X13 | Reach Compliance Code: | unknown |
风险等级: | 5.7 | Is Samacsys: | N |
其他特性: | DYNAMIC BUS SIZING; 3 PIPELINE STAGES | 地址总线宽度: | 24 |
位大小: | 32 | 边界扫描: | NO |
最大时钟频率: | 25 MHz | 外部数据总线宽度: | 32 |
格式: | FIXED POINT | 集成缓存: | YES |
JESD-30 代码: | S-PPGA-P100 | JESD-609代码: | e0 |
长度: | 34.545 mm | 低功率模式: | NO |
DMA 通道数量: | 外部中断装置数量: | 8 | |
串行 I/O 数: | 端子数量: | 100 | |
片上数据RAM宽度: | 最高工作温度: | 70 °C | |
最低工作温度: | 封装主体材料: | PLASTIC/EPOXY | |
封装代码: | PGA | 封装等效代码: | PGA100M,13X13 |
封装形状: | SQUARE | 封装形式: | GRID ARRAY |
电源: | 5 V | 认证状态: | Not Qualified |
RAM(字数): | 0 | 座面最大高度: | 4.7 mm |
速度: | 25 MHz | 子类别: | Microprocessors |
最大供电电压: | 5.25 V | 最小供电电压: | 4.75 V |
标称供电电压: | 5 V | 表面贴装: | NO |
技术: | HCMOS | 温度等级: | COMMERCIAL |
端子面层: | Tin/Lead (Sn/Pb) | 端子形式: | PIN/PEG |
端子节距: | 2.54 mm | 端子位置: | PERPENDICULAR |
宽度: | 34.545 mm | uPs/uCs/外围集成电路类型: | MICROPROCESSOR |
Base Number Matches: | 1 |
型号 | 品牌 | 替代类型 | 描述 | 数据表 |
MC68EC020RP16 | MOTOROLA |
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