MC33363B
High Voltage Switching
Regulator
The MC33363B is a monolithic high voltage switching regulator
that is specifically designed to operate from a rectified 240 Vac line
source. This integrated circuit features an on−chip 700 V/1.0 A
SENSEFETt power switch, 500 V active off−line startup FET, duty
cycle controlled oscillator, current limiting comparator with a
programmable threshold and leading edge blanking, latching pulse
width modulator for double pulse suppression, high gain error
amplifier, and a trimmed internal bandgap reference. Protective
features include cycle−by−cycle current limiting, input undervoltage
lockout with hysteresis, overvoltage protection, and thermal
shutdown. This device is available in a 16−lead dual−in−line and wide
body surface mount packages.
http://onsemi.com
MARKING
DIAGRAMS
16
SO−16WB
DW SUFFIX
CASE 751N
1
MC33363BDW
AWLYYWWG
Features
• On−Chip 700 V, 1.0 A SENSEFET Power Switch
• Rectified 240 Vac Line Source Operation
• On−Chip 500 V Active Off−Line Startup FET
• Latching PWM for Double Pulse Suppression
• Cycle−By−Cycle Current Limiting
• Input Undervoltage Lockout with Hysteresis
• Over−Voltage Protection
A
= Assembly Location
WL = Wafer Lot
YY = Year
WW = Work Week
G
= Pb−Free Package
PIN CONNECTIONS
• Trimmed Internal Bandgap Reference
• Internal Thermal Shutdown
Power Switch
Drain
Startup Input
1
16
• Pb−Free Packages are Available*
V
3
4
5
6
7
8
CC
13
12
11
10
9
AC Input
GND
GND
Startup Input
1
Overvoltage
Protection Input
Voltage Feedback
Input
R
T
Regulator
Output
Startup
Mirror
V
C
CC
T
Reg
3
8
Compensation
DC Output
Regulator Output
UVLO
OVP
Overvoltage
Protection
Input
(Top View)
6
R
C
11
16
T
PWM Latch
ORDERING INFORMATION
Osc
T
Power Switch
Drain
7
Driver
S
Q
R
†
Device
Package
Shipping
MC33363BDW
SO−16WB
47 Units/Rail
47 Units/Rail
PWM
LEB
MC33363BDWG
SO−16WB
(Pb−Free)
I
pk
Compensation
9
Thermal
MC33363BDWR2
SO−16WB 1000 Tape & Reel
MC33363BDWR2G SO−16WB 1000 Tape & Reel
(Pb−Free)
10
EA
Voltage
Feedback
Input
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
GND 4, 5, 12, 13
Figure 1. Simplified Application
*For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting
Techniques Reference Manual, SOLDERRM/D.
© Semiconductor Components Industries, LLC, 2005
1
Publication Order Number:
November, 2005 − Rev. 6
MC33363B/D