是否Rohs认证: | 符合 | 生命周期: | Obsolete |
零件包装代码: | TSOP1 | 包装说明: | PLASTIC, REVERSE, TSOP1-48 |
针数: | 48 | Reach Compliance Code: | compliant |
ECCN代码: | EAR99 | HTS代码: | 8542.32.00.51 |
风险等级: | 5.21 | 最长访问时间: | 90 ns |
备用内存宽度: | 8 | 启动块: | BOTTOM |
JESD-30 代码: | R-PDSO-G48 | JESD-609代码: | e3 |
长度: | 18.4 mm | 内存密度: | 16777216 bit |
内存集成电路类型: | FLASH | 内存宽度: | 16 |
功能数量: | 1 | 端子数量: | 48 |
字数: | 1048576 words | 字数代码: | 1000000 |
工作模式: | ASYNCHRONOUS | 最高工作温度: | 85 °C |
最低工作温度: | -40 °C | 组织: | 1MX16 |
封装主体材料: | PLASTIC/EPOXY | 封装代码: | TSOP1-R |
封装形状: | RECTANGULAR | 封装形式: | SMALL OUTLINE, THIN PROFILE |
并行/串行: | PARALLEL | 峰值回流温度(摄氏度): | 260 |
编程电压: | 3 V | 认证状态: | Not Qualified |
座面最大高度: | 1.2 mm | 最大供电电压 (Vsup): | 3.6 V |
最小供电电压 (Vsup): | 2.7 V | 标称供电电压 (Vsup): | 3 V |
表面贴装: | YES | 技术: | CMOS |
温度等级: | INDUSTRIAL | 端子面层: | MATTE TIN |
端子形式: | GULL WING | 端子节距: | 0.5 mm |
端子位置: | DUAL | 处于峰值回流温度下的最长时间: | 40 |
类型: | NOR TYPE | 宽度: | 12 mm |
Base Number Matches: | 1 |
型号 | 品牌 | 获取价格 | 描述 | 数据表 |
MBM29DL164TD | FUJITSU |
获取价格 |
16M (2M x 8/1M x 16) BIT Dual Operation | |
MBM29DL164TD12PBT | FUJITSU |
获取价格 |
1MX16 FLASH 3V PROM, 120ns, PBGA48, PLASTIC, FBGA-48 | |
MBM29DL164TD-12PBT | FUJITSU |
获取价格 |
Flash, 1MX16, 120ns, PBGA48, PLASTIC, FBGA-48 | |
MBM29DL164TD12PFTN | FUJITSU |
获取价格 |
1MX16 FLASH 3V PROM, 120ns, PDSO48, PLASTIC, TSOP1-48 | |
MBM29DL164TD-12PFTN | SPANSION |
获取价格 |
Flash, 1MX16, 120ns, PDSO48, | |
MBM29DL164TD12PFTR | FUJITSU |
获取价格 |
1MX16 FLASH 3V PROM, 120ns, PDSO48, PLASTIC, REVERSE, TSOP1-48 | |
MBM29DL164TD-12PFTR | FUJITSU |
获取价格 |
Flash, 1MX16, 120ns, PDSO48, PLASTIC, REVERSE, TSOP1-48 | |
MBM29DL164TD-12PFTR | SPANSION |
获取价格 |
Flash, 1MX16, 120ns, PDSO48, | |
MBM29DL164TD-70PBT | SPANSION |
获取价格 |
FLASH MEMORY CMOS 16M (2M X 8/1M X 16) BIT Dual Operation | |
MBM29DL164TD-70PFTN | SPANSION |
获取价格 |
FLASH MEMORY CMOS 16M (2M X 8/1M X 16) BIT Dual Operation |