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MBL800D33C PDF预览

MBL800D33C

更新时间: 2024-10-23 14:53:07
品牌 Logo 应用领域
瑞萨 - RENESAS 局域网双极性晶体管功率控制
页数 文件大小 规格书
2页 169K
描述
800A, 3300V, N-CHANNEL IGBT

MBL800D33C 技术参数

生命周期:Transferred包装说明:FLANGE MOUNT, R-XUFM-X9
Reach Compliance Code:compliant风险等级:5.68
其他特性:HIGH RELIABILITY, LOW NOISE外壳连接:ISOLATED
最大集电极电流 (IC):800 A集电极-发射极最大电压:3300 V
配置:COMPLEXJESD-30 代码:R-XUFM-X9
元件数量:2端子数量:9
封装主体材料:UNSPECIFIED封装形状:RECTANGULAR
封装形式:FLANGE MOUNT极性/信道类型:N-CHANNEL
认证状态:Not Qualified表面贴装:NO
端子形式:UNSPECIFIED端子位置:UPPER
晶体管应用:POWER CONTROL晶体管元件材料:SILICON
标称断开时间 (toff):3500 ns标称接通时间 (ton):2900 ns
Base Number Matches:1

MBL800D33C 数据手册

 浏览型号MBL800D33C的Datasheet PDF文件第2页 
Relation No.IGBT-SP-03008 R0  
IGBT MODULE  
MBL800D33C  
Silicon N-channel IGBT  
OUTLINE DRAWING  
FEATURES  
High thermal fatigue durability.(delta Tc=70 oC,N>30,000cycles)  
low noise due to built-in free-wheeling  
diode – ultra soft fast recovery diode(USFD).  
High speed,low loss IGBT module.  
Low driving power due to low input  
capacitance MOS gate.  
High reliability,high durability module.  
lsolated head sink(terminal to base).  
CIRCUIT DIAGRAM  
ABSOLUTE MAXIMUM RATINGS (Tc=25oC )  
Item  
Symbol  
Unit  
MBL800D33C  
Collector Emitter Voltage  
Gate Emitter Voltage  
VCES  
VGES  
IC  
ICp  
IF  
IFM  
Pc  
Tj  
Tstg  
VISO  
-
V
V
3,300  
±20  
800  
1,600  
800  
1,600  
8,000  
DC  
1ms  
DC  
Collector Current  
A
Forward Current  
A
1ms  
Collector Power Dissipation  
Junction Temperature  
Storage Temperature  
lsolation Voltage  
W
oC  
-40 ~ +125  
-40 ~ +125  
6,000(AC 1 minute)  
oC  
VRMS  
Terminals (M4/M8)  
Mounting (M6)  
2/10  
6
(1)  
(2)  
Screw Torque  
N·m  
-
Notes: (1) Recommended Value 1.8±0.2/9±1N·m  
(2) Recommended Value 5.5±0.5N·m  
CHARECTERISTICS (Tc=25 oC)  
1) IGBT + FWD  
Item  
Symbol Unit Min. Typ. Max.  
Test Conditions  
Collector Emitter Cut-Off Current  
Gate Emitter Leakage Current  
Collector Emitter Saturation Voltage  
Gate Emitter Threshold Voltage  
Input Capacitance  
I CES  
IGES  
VCE(sat)  
VGE(TO)  
Cies  
tr  
ton  
tf  
toff  
VFM  
mA  
nA  
V
V
nF  
-
-
-
-
-
12.0 VCE=3,300V, VGE=0V  
±500 VGE=±20V, VCE=0V  
5.0 IC=800A, VGE=15V  
6.5 VCE=5V, Ic=800mA  
4.1  
5.5  
100  
2.0  
2.9  
1.7  
3.5  
2.2  
4.5  
-
-
-
-
-
-
-
VCE=10V, VGE=0V,f=100KHz  
VCC=1,650V, Ic=800A  
L=120nH  
Rise Time  
3.2  
3.8  
3.2  
5.6  
Turn On Time  
Fall Time  
Switching Times  
µs  
RG=4.7(3)  
V
GE=±15V, Tc=125oC  
Turn Off Time  
Peak Forward Voltage Drop  
V
2.8 -Ic=800A, VGE=0V  
VCC=1,650V, IF =800A (4)  
L=120nH, Tc=125oC  
1.4  
Reverse Recovery Time  
trr  
µs  
-
0.8  
IGBT  
Thermal Impedance  
FWD  
Rth(j-c)  
Rth(j-c)  
-
-
-
-
0.012  
oC/W  
Junction to case  
0.024  
2) DIODE  
Item  
Symbol Unit Min. Typ. Max.  
Test Conditions  
I AKS  
VF  
mA  
V
-
-
-
12.0  
3.0  
Collector Emitter Cut-Off Current  
Peak Forward Voltage Drop  
Reverse Recovery Time  
VAK=3,300V  
IF =800A  
2.4  
-
0.8  
1.4 IF =800A, VCC=1,650V (4)  
trr  
µs  
L=120nH, Tc=125oC  
Junction to case  
Rth(j-c) oC/W  
0.024  
Thermal Impedance  
Notes: (3) RG value is the test condition's value for decision of the swiching times,  
not recommended value. Determine the suitable RG value after the  
measurement of switching waveforms(overshoot voltage,etc.)with appliance mounted.  
(4)Counter arm IGBT GE=-15V  
V
PDE-L800D33C-0  

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