MBL1S THRU MBL10S
Features
• High Temperature Soldering Guaranteed:260°C/10 Second
• Saves Space On Printed Circuit Board
0.5 Amp Single Phase
Glass Passivated
Bridge Rectifier
• Halogen Free Available Upon Request By Adding Suffix "-HF"
• Epoxy Meets UL 94 V-0 Flammability Rating
• Moisture Sensitivity Level 1
• Lead Free Finish/RoHS Compliant (Note1) ("P"Suffix Designates
Compliant. See Ordering Information)
100 to 1000 Volts
• Teminals: Plated Leads Solderable Per MIL-STD-750,Method 2026
Maximum Ratings
• Operating Junction Temperature Range: -55°C to +150°C
• Storage Temperature Range: -55°C to +150°C
MBLS-1
• Typical Thermal Resistance(Note2): 134°C/W Junction to Ambient
• Typical Thermal Resistance(Note3): 134°C/W Junction to Ambient
• Typical Thermal Resistance(Note2): 20°C/W Junction to Lead
-
∼
∼
B
D
E
Maximum
Maximum
RMS
Voltage
Maximum DC
Blocking
+
Device
MCC
Recurrent
Peak Reverse
Voltage
Marking
Part Number
Voltage
F
C
A
MBL1S
MBL2S
MBL4S
MBL6S
MBL8S
MBL10S
BL1S
BL2S
BL4S
BL6S
BL8S
BL10S
100V
200V
400V
600V
800V
1000V
70V
100V
200V
400V
600V
800V
1000V
140V
280V
420V
480V
700V
G
J
H
+
~
_
~
Electrical Characteristics @ 25°C Unless Otherwise Specified
DIMENSIONS
MM
MIN MAX MIN MAX
Average
Forward Current
0.5A(2)
0.8A(3)
IF(AV)
See Fig.1
INCHES
DIM
NOTE
A
B
C
D
E
F
G
H
J
0.252 0.283 6.40 7.20
0.087 0.102 2.20 2.60
0.142 0.193 3.60 4.90
0.177 0.200 4.55 5.10
0.022 0.033 0.55 0.84
0.045 0.063 1.15 1.60
0.000 0.008 0.00 0.20
0.016 0.043 0.40 1.10
0.004 0.016 0.10 0.35
Peak Forward
Surge Current
IFSM
8.3ms, Half Sine
35A
Maximum
Instantaneous
Forward Voltage
IFM = 0.4A
VF
1.0V
TA = 25°C
Maximum DC
Reverse Current at
Rated DC Blocking
Voltage
TA = 25°C
IR
10μA
0.031
(0.80)
Typical Junction
Capacitance
Measured at
1.0MHz, VR=4.0V
13pF
CJ
0.280
(7.10)
5.1A2S
Rating For Fusing
I2t
0.055
(1.40)
t<8.3ms
Note: 1. High Temperature Solder Exemption Applied, see EU Directive Annex Notes 7
2. On glass epoxy P.C.B. mounted on 0.05 x 0.05”(1.3 x 1.3mm)pads
0.105 (2.67)
0.095 (2.41)
3. On aluminum substrate P.C.B. with an area of 0.8” x 0.8”(20 x 20mm) mounted
on 0.05 x 0.05”(1.3x 1.3mm) solder pad
Rev.3-2-12012020
1/3
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