Datasheet > MBL8S

MBL8S

更新时间： 2024-10-24 14:53:15

品牌	Logo	应用领域
美微科 - MCC		/
页数	文件大小	规格书
3页	810K
描述
Tape&Reel: 4Kpcs/Reel;

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中文翻译

获取价格

数据手册

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MBL8S 数据手册

MBL1S THRU MBL10S

Features

• High Temperature Soldering Guaranteed:260°C/10 Second

• Saves Space On Printed Circuit Board

0.5 Amp Single Phase

Glass Passivated

Bridge Rectifier

• Halogen Free Available Upon Request By Adding Suffix "-HF"

• Epoxy Meets UL 94 V-0 Flammability Rating

• Moisture Sensitivity Level 1

• Lead Free Finish/RoHS Compliant (Note1) ("P"Suffix Designates

Compliant. See Ordering Information)

100 to 1000 Volts

• Teminals: Plated Leads Solderable Per MIL-STD-750,Method 2026

Maximum Ratings

• Operating Junction Temperature Range: -55°C to +150°C

• Storage Temperature Range: -55°C to +150°C

MBLS-1

• Typical Thermal Resistance(Note2): 134°C/W Junction to Ambient

• Typical Thermal Resistance(Note3): 134°C/W Junction to Ambient

• Typical Thermal Resistance(Note2): 20°C/W Junction to Lead

∼

Maximum

RMS

Voltage

Maximum DC

Blocking

Device

MCC

Recurrent

Peak Reverse

Voltage

Marking

Part Number

Voltage

MBL1S

MBL2S

MBL4S

MBL6S

MBL8S

MBL10S

BL1S

BL2S

BL4S

BL6S

BL8S

BL10S

100V

200V

400V

600V

800V

1000V

70V

100V

200V

400V

600V

800V

1000V

140V

280V

420V

480V

700V

Electrical Characteristics @ 25°C Unless Otherwise Speciﬁed

DIMENSIONS

MIN MAX MIN MAX

Average

Forward Current

0.5A⁽²⁾

0.8A⁽³⁾

I_F(AV)

See Fig.1

INCHES

DIM

NOTE

0.252 0.283 6.40 7.20

0.087 0.102 2.20 2.60

0.142 0.193 3.60 4.90

0.177 0.200 4.55 5.10

0.022 0.033 0.55 0.84

0.045 0.063 1.15 1.60

0.000 0.008 0.00 0.20

0.016 0.043 0.40 1.10

0.004 0.016 0.10 0.35

Peak Forward

Surge Current

I_FSM

8.3ms, Half Sine

35A

Maximum

Instantaneous

Forward Voltage

I_FM= 0.4A

V_F

1.0V

T_A= 25°C

Maximum DC

Reverse Current at

Rated DC Blocking

Voltage

T_A= 25°C

I_R

10μA

0.031

(0.80)

Typical Junction

Capacitance

Measured at

1.0MHz, V_R=4.0V

13pF

C_J

0.280

(7.10)

5.1A²S

Rating For Fusing

I²t

0.055

(1.40)

t<8.3ms

Note: 1. High Temperature Solder Exemption Applied, see EU Directive Annex Notes 7

2. On glass epoxy P.C.B. mounted on 0.05 x 0.05”(1.3 x 1.3mm)pads

0.105 (2.67)

0.095 (2.41)

3. On aluminum substrate P.C.B. with an area of 0.8” x 0.8”(20 x 20mm) mounted

on 0.05 x 0.05”(1.3x 1.3mm) solder pad

Rev.3-2-12012020

1/3

MCCSEMI.COM

12 3

中文翻译

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