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MB2S PDF预览

MB2S

更新时间: 2024-11-11 12:34:23
品牌 Logo 应用领域
星合电子 - GXELECTRONICS 二极管IOT
页数 文件大小 规格书
2页 842K
描述
Glass passivated chip junctions

MB2S 数据手册

 浏览型号MB2S的Datasheet PDF文件第2页 
MB1S-MB10S  
星合 子  
XINGHE ELECTRONICS  
VOLTAGE RANGE: 50 --- 1000 V  
CURRENT: 0.5 A  
FEATURES  
This series is UL recognized under Component Index,  
file number E239431  
Glass passivated chip junctions  
Plastic materrial has U/L flammabilityclassification  
94V-O  
MBS  
4.6±0.2  
High surge overload rating: 35A peak  
Saves space on printed circuit boards  
High temperature soldering guaranteed:  
260°C/10 seconds at 5 lbs. (2.3kg) tension  
MECHANICAL DATA  
3.8±0.2  
Case: Molded plastic bodyover passivated junctions  
Terminals: Plated leads solderable per MIL-STD-750,  
Method 2026  
0.6±0.1  
2.5±0.25  
1.0±0.15  
6.8±0.2  
0.3±0.1  
Polarity: Polaritysymbols marked on body  
Dimensions in inches and (millimeters)  
Mounting Position: Any  
Dimensions in millimeters  
Weight: 0.0078 ounce, 0.22 gram  
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS  
Ratings at 25  
ambient temperature unless otherwise specified.  
Single phase,half wave,60 Hz,resistive or inductive load. For capacitive load,derate by20%.  
MB05S MB1S MB2S MB4S MB6S MB8S MB10S  
UNITS  
50  
35  
50  
100  
70  
200  
140  
200  
400  
280  
600  
420  
600  
800  
560  
800  
1000  
700  
V
V
V
Maximum recurrent peak reverse voltage  
Maximum RMS voltage  
VRRM  
VRMS  
VDC  
100  
400  
1000  
Maximum DC blocking voltage  
Maximum average forw ard  
1)  
0.5  
A
IF(AV)  
2)  
0.8  
output current  
@TA=25  
Peak forw ard surge current  
8.3ms single half-sine-w ave  
superimposed on rated load  
IFSM  
A
V
35.0  
Maximum instantaneous forw ard voltage  
@ 0.4 A  
VF  
1.0  
A
Maximum reverse current  
@TA=25  
5.0  
0.5  
13  
μ
IR  
mA  
pF  
at rated DC blocking voltage @TA=100  
Typical junction capacitance per leg (NOTE 3)  
CJ  
Typical thermal resistance per leg (NOTE 1)  
R θJA  
RθJL  
85  
20  
/W  
(NOTE 2)  
Operating junction temperature range  
Storage temperature range  
- 55 ---- + 150  
TJ  
TSTG  
- 55 ---- + 150  
NOTES: (1) On glass epoxy P.C.B. mounted on 0.05 x 0.05" (1.3 x 1.3mm) pads  
(2) On aluminum substrate P.C.B. with an area of 0.8" x 0.8" (20 x 20mm) mounted on 0.05 x 0.05" (1.3 x 1.3mm) solder pad  
(3) Measured at 1.0 MHz and applied reverse v oltage of 4.0 Volts  
1
GAOMI XINGHE ELECTRONICSCO.,LTD.  
WWW.SDDZG.COM  
TEL:0536-2210359  
QQ:464768017  

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