Datasheet > MB05S_09

MB05S_09

更新时间： 2024-09-19 11:13:43

品牌	Logo	应用领域
美微科 - MCC		/
页数	文件大小	规格书
3页	111K
描述
0.5Amp Single Phase Glass Passivated Bridge Rectifier 50 to 1000 Volts

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中文翻译

获取价格

数据手册

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MB05S_09 数据手册

M C C

MB05S

THRU

MB10S

ꢀꢁꢂꢃꢄꢅꢆꢄꢇꢇꢈꢃꢂꢁꢉꢊꢅꢆomponents

20736 Marilla Street Chatsworth

ꢆꢋꢅꢌꢍꢎꢍꢍ

ꢏꢐꢄꢑꢈꢒꢅꢓꢔꢍꢔ ꢅ!ꢕꢍ"#ꢌꢎꢎ

$ꢉ%ꢒꢅ ꢅ ꢅ ꢓꢔꢍꢔ ꢅ!ꢕꢍ"#ꢌꢎꢌ

Micro Commercial Components

Features

0.5 Amp Single Phase

Glass Passivated

Bridge Rectifier

•

Glass Passivated Diode Construction

High Temperature Soldering Guaranteed:260oC/10 Second

Saves Space On Printed Circuit Board

Mechanical Data

50 to 1000 Volts

•

Lead Free Finish/RoHS Compliant (NOTE 1)("P" Suffix

designates RoHS Compliant. See ordering information)

Case Material:Molded Plastic. UL Flammability

Classification Rating 94V-0 and MSL Rating 1

MBS -1

•

Teminals: Plated leads Solderable per MIL-STD-750,Method 2026

Moisture Sensitiviy:Level 1 per J-STD-020C

∼

MCC

Part

Number

Maximum

Recurrent

Maximum

RMS

Voltage

Maximum

Blocking

Voltage

50V

Device

Marking Peak Reverse

Voltage

MB05S

MB1S

MB2S

MB4S

MB6S

MB8S

MB10S

MB05S

MB1S

MB2S

MB4S

MB6S

MB8S

MB10S

50V

100V

200V

400V

600V

800V

1000V

35V

70V

100V

200V

Notch in case

140V

280V

420V

480V

700V

400V

600V

800V

1000V

Electrical Characteristics @ 25^OC Unless Otherwise Specified

Average Forward

Current

I_F(AV)

0.5 A⁽²⁾

0.8 A⁽³⁾

35A

See Fig.1

Peak Forward Surge

Current

Maximum

I_FSM

8.3ms, half sine

Case Style

ꢀꢁꢂꢃꢄꢅꢁꢆꢄꢅ

Instantaneous

Forward Voltage

Maximum DC

Reverse Current At

Rated DC Blocking

Voltage

V_F

1.0V

I_FM= 0.4A;

T_A= 25^OC

ꢇ ꢇ ꢇ ꢇ ꢁꢄꢈ

ꢉꢃꢅ

ꢂꢂ

ꢀꢁꢂ

ꢊ

ꢂꢁꢄ

.252

ꢎꢏꢐꢑ

ꢂꢊꢋ

.275

ꢎꢒꢏ6

ꢂꢁꢄ

6.40

ꢓꢎꢔꢒ

ꢂꢊꢋ

7.00

2.70

4.20

4.95

0.80

2.70

0.20

ꢄꢆꢌꢃ

^OC

ꢍ

I_R

T_A= 25

5uA

100uA

ꢃ

ꢕ

.150

.179

.019

.090

.004

.165

.195

.031

.106

.008

3.80

4.55

0.50

2.30

0.10

T_A= 125 ^O

85^O/W⁽²⁾

Typical Thermal

Resistance

per leg

thJA

ꢖ

^OC

(3)

ꢉ

ꢗ

.027

.058

.195

.039

.043

.062

.205

.049

0.70

1.47

4.95

0.99

1.10

1.57

5.21

1.24

R_thJA

R_thJL

70 /W

20^OC/W⁽²⁾

13pF

ꢘ

Typical Junction

Capacitance

C_J

Measured at

1.0MHz, V_R=4.0V

t<8.30ms

.006

.016

0.15

0.41

I²t

T_J

5.0A²s

-55to+150

Mounting Pad Layout

Rating For Fusing

Operating Junction

and Storage

0.023 MIN.

(0.58 MIN.)

^OC

T_STG

Temperature Range

Notes: 1. High Temperature Solder Exemption Applied, see EU Directive Annex Notes 7

0.272 MAX.

(6.91 MAX.)

2. On glass epoxy P.C.B. mounted on 0.05 x 0.05”(1.3 x 1.3mm)pads

3. On aluminum substrate P.C.B. with an area of 0.8” x 0.8”(20 x 20mm) mounted

on 0.05 x 0.05”(1.3x 1.3mm) solder pad

0.030 MIN.

(0.76 MIN.)

0.105 (2.67)

0.095 (2.41)

www.mccsemi.com

1 of 3

Revision: 12

2009/10/22

12 3

中文翻译

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