19-194±; Rev 6; 1/12
Low-Voltage 8:1 Mux/Dual 4:1 Mux/Triple SPDT/
Quad SPDT in UCSP Package
1–MAX694
General Description
Features
The MAX4691–MAX4694 are low-voltage CMOS analog
ICs configured as an 8-channel multiplexer (MAX4691),
two 4-channel multiplexers (MAX4692), three single-
pole/double-throw (SPDT) switches (MAX4693), and
four SPDT switches (MAX4694).
o 16 Bump, 0.5mm-Pitch UCSP (2mm x 2mm)
o 1.8V Logic Compatibility
o Guaranteed On-Resistance
70Ω (max) with +2.7V Supply
35Ω (max) with +5V Supply
The MAX4691/MAX4692/MAX4693 operate from either
a single +2V to +11V power supply or dual ±2V to
±±.±V power supplies. ꢀhen operating from ±±V sup-
25Ω (max) with ±±.5V ꢀual Supplies
o Guaranteed Match Between Channels
5Ω (max) with +2.7V Supply
plies they offer 2±Ω on-resistance (R ), 3.±Ω (max)
ON
R
flatness, and 3Ω (max) matching between chan-
ON
3Ω (max) with ±±.5V ꢀual Supplies
nels. The MAX4694 operates from a single +2V to +11V
supply. Each switch has rail-to-rail signal handling and
a low 1nA leakage current.
o Guaranteed Flatness Over Signal Range
3.5Ω (max) with ±±.5V ꢀual Supplies
o Low Leakage Currents Over Temperature
All digital inputs are 1.8V logic-compatible when oper-
ating from a +3V supply and TTL compatible when
operating from a +±V supply.
20nA (max) at +85°C
o Fast 90ns Transition Time
The MAX4691–MAX4694 are available in 16-pin,
o Guaranteed Break-Before-Make
o Single-Supply Operation from +2V to +11V
ꢀ
4mm 4mm QFN and TQFN and 16-bump UCSP pack-
ages. The chip-scale package (UCSP™) occupies a
ꢀ
2mm 2mm area, significantly reducing the required
o ꢀual-Supply Operation from ±2V to ±5.5V
PC board area.
(MAX±691/MAX±692/MAX±693)
o V+ to V- Signal Handling
Applications
Audio and Video Signal Routing
Cellular Phones
o Low Crosstalk: -90dB (100kHz)
o High Off-Isolation: -88dB (100kHz)
Battery-Operated Equipment
Communications Circuits
Modems
Ordering Information
PART
TEMP RANGE
-40°C to +8±°C
-40°C to +8±°C
-40°C to +8±°C
-40°C to +8±°C
-40°C to +8±°C
-40°C to +8±°C
-40°C to +8±°C
-40°C to +8±°C
-40°C to +8±°C
-40°C to +8±°C
-40°C to +8±°C
-40°C to +8±°C
PIN-PACKAGE
16-Bump UCSP*
16 QFN-EP†
16 TQFN-EP†
16-Bump UCSP*
16 QFN-EP†
16 TQFN-EP†
16-Bump UCSP*
16 QFN-EP†
16 TQFN-EP†
16-Bump UCSP*
16 QFN-EP†
Functional Diagrams
MAX4691EBE+T
MAX4691EGE+
MAX4691ETE+T
MAX4692EBE+T
MAX4692EGE+
MAX4692ETE+T
MAX4693EBE+T
MAX4693EGE+
MAX4693ETE+T
MAX4694EBE+T
MAX4694EGE+
MAX4694ETE+T
MAX4691
X0
X1
X2
X3
X
X4
X5
X6
X7
16 TQFN-EP†
LOGIC
B
EN
*UCSP reliability is integrally linked to the user’s assembly meth-
ods, circuit board, and environment. See the UCSP Reliability
section for more information.
A
C
†EP = Exposed pad.
+Denotes a lead(Pb)-free/RoHS-compliant package.
T = Tape and reel.
Pin Configurations appear at end of data sheet.
Functional ꢀiagrams continued at end of data sheet.
UCSP is a trademark of Maxim Integrated Products, Inc.
________________________________________________________________ Maxim Integrated Products
1
For pricing, delivery, and ordering information, please contact Maxim ꢀirect at 1-888-629-±6±2,
or visit Maxim’s website at www.maxim-ic.com.