MAX20317
Universal 3.5mmØ Accessory Management IC
General Description
Benefits and Features
● Allows Wide Range of Applications by Supporting
2
The MAX20317 is an I C controllable, universal 3.5mmØ
accessory management IC. The device provides a universal
jack interface solution, as well as a compact solution for
the power management and interface control of a powered
accessory, such as an active noise cancelling (ANC)
headset.
The MAX20317 automatically measures headset
impedance with a high precision, triple current source
8 bit ADC. After impedance detection, the device also
detects when a headset is in a CTIA or OMTP configuration
and automatically configures the SLEEVE and RING2
terminals to correctly connect the microphone and ground
lines.
When a boost supply is applied, the MAX20317 can
detect the presence of an ANC headset. When the ANC
headset is detected and enabled, a button-press monitoring
circuit activates and flags button presses by detecting the
voltage drop across a sense resistor.
The MAX20317 provides a power line communication tool
to a headset to exchange the data with the host device.
The MAX20317 has the two separate ground sense inputs
from the SLEEVE and RING2 terminals of the connector
to provide a high ground isolation to the audio codec.
Universal 3.5mm Jack Types
• Auto-Configuration for CTIA and OMTP Headsets
• Supports MEMS Microphone
• 50mΩ Ground Switch
● Enables Long Utilization of Accessories by Supplying
Power Through 3.5mm Jack
• Powered Accessory/Headset Detection
• Bypass Switch to Power Accessories such as
ANC Headsets
• Programmable Button Detection in Powered
Accessory Mode
● Empowers New Path in Data Communication to
Accessories
• Power Line Communication by 3.5mm Jack
• Bidirectional Digital Data Communication in Power
Mode
• Allow Emergence of New Accessory Types
● Provides Comfortable Sounds by Introducing
Automatic Volume Adjustment
• Adaptive Volume Control Based on Precision
Headset Impedance
• False Insertion Detection
The MAX20317 is available in a space-saving, 20-bump,
0.4mm pitch, 1.65mm x 2.05mm wafer-level package
(WLP) and operates over the -40°C to +85°C extended
temperature range.
● Saves Board Space with Small Form Factor
• 1.65mm x 2.05mm 4 x 5 Array 20 Bump 0.4mm
Pitch WLP
Applications
● Smart Phones
Ordering Information appears at end of data sheet.
● Tablet PCs
● Phablet
● Notebook PCs
Typical Application Circuit
CODEC
VCC
+5V
MIC1
MIC1-BIAS
R-G L-G R-A L-A
1µF
1µF
6.8
VIO
RSEN
MIC_OUT
V
CC
V
BOOST
G_SNSR
G_SNSL
SLEEVE
APPLICATION
PROCESSOR
MIC
MAX20317
LEFT
DET
RING2
DETIN
SDA
SCL
SDA
SCL
INT
SLEEVE_SL
RIGHT
GND
SLEEVE_SR
RING2_SL
RING2_SR
DGND
GND
19-100037; Rev 0; 5/17