Datasheet > MASW-011111-DIE

MASW-011111-DIE

更新时间： 2024-01-03 09:50:10

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MACOM		/
页数	文件大小	规格书
6页	367K
描述
AlGaAs SP2T PIN Diode Switch with integrated bias circuits Wideband, 80 - 100 GHz

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MASW-011111-DIE 数据手册

AlGaAs SP2T PIN Diode Switch with integrated bias circuits

Wideband, 80 - 100 GHz

MASW-011111-DIE

Rev. V2

Solder Die Attach

Outline Drawing

All die attach and bonding methods should be

compatible with gold metal. Solder which does not

scavenge gold, such as 80 Au/20 Sn or Indalloy #2,

is recommended. Do not expose die to

temperature greater than 300°C for more than

10 seconds.

Electrically Conductive Epoxy

Die Attach

Assembly can be preheated to approximately 125°C.

Use a controlled thickness of approximately 1 mils

for best electrical conductivity and lower thermal

resistance. A thin epoxy fillet should be visible

around the perimeter of the chip after placement.

Cure epoxy per manufacturer’s schedule. For

extended cure times, temperatures should be kept

below 150°C.

Wire / Ribbon Bonding

Wedge thermo compression bonding may be used

to attach ribbons to the RF bonding pads. Gold

ribbons should be at least 1/4 by 2 mil for lowest

inductance. The same gold ribbon or 1 mil dia. gold

wire is recommended for all DC pads.

Dimensions are in µm.

MACOMTechnology Solutions Inc. (MACOM) andits affiliatesreserve theright to makechanges to the product(s) orinformationcontained herein without notice.

Visit www.macom.com for additional data sheets and product information.

For further information andsupport please visit:

https://www.macom.com/support

DC-0018899

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