Datasheet > MASW-011176

MASW-011176

更新时间： 2023-12-06 20:07:56

品牌	Logo	应用领域
MACOM		/
页数	文件大小	规格书
8页	955K
描述
HMIC? Silicon PIN Diode SP4T Switch with Integrated Bias Network, 2 - 18 GHz

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MASW-011176 数据手册

HMIC™ Silicon PIN Diode SP4T Switch with

Integrated Bias Network, 2 - 18 GHz

MASW-011176

Rev. V1

Features

Functional Diagram

•

Broad Bandwidth Specified up to 18 GHz

Integrated Bias Network

Low Insertion Loss / High Isolation

Fully Monolithic Glass Encapsulated Chip

Die Size: 2.76 x 2.24 mm

RoHS* Compliant

Applications

•

Aerospace & Defense

ISM

Radar

Test & Measurement

Description

The MASW-011176 device is a SP4T broadband

switch with integrated bias networks offered as a

bare die part. Large bond pads facilitate the use of

low inductance ribbon bonds, while gold backside

metallization allows for manual or automatic chip

bonding via 80/20 - Au/Sn, 62/36/2 - Sn/Pb/Ag

solders or electrically conductive silver epoxy.

Pin Configuration¹

Description

RF1 (Common Arm)

RF1 Bias

RF2 Bias

RF2

These high performance switches are suitable for

use in multi-band ECM, Radar, and instrumentation

control circuits where high isolation to insertion loss

ratios are required. With a standard +5 V / -5 V, TTL

controlled PIN diode driver, 70 ns switching speeds

can be achieved.

RF3 Bias

RF3

Ordering Information

RF4

RF4 Bias

RF5

MASW-011176-DIE

MASW-011176-SMB

Die in Gel Pack

Sample Board

RF5 Bias

1. The exposed metallization on the chip bottom must be

connected to RF, DC, and thermal ground.

* Restrictions on Hazardous Substances, compliant to current RoHS EU directive.

MACOM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice.

Visit www.macom.com for additional data sheets and product information.

For further information and support please visit:

https://www.macom.com/support

DC-0025312

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