Material Content Data Sheet
Sales Product Name BSZ018NE2LS
Issued
19. February 2015
36.78 mg
MA#
MA001336490
Package
PG-TSDSON-8-26
Weight*
Average
Mass
[%]
Average
Sum
CAS#
Weight
[mg]
Sum
Construction Element
Material Group
Substances
Mass
[%]
[ppm]
if applicable
[ppm]
18243
67
chip
inorganic material
inorganic material
non noble metal
non noble metal
non noble metal
noble metal
silicon
phosphorus
zinc
7440-21-3
7723-14-0
7440-66-6
7439-89-6
7440-50-8
7440-57-5
1333-86-4
-
0.671
0.002
0.010
0.197
7.988
0.028
0.037
1.893
16.451
0.395
0.020
0.024
0.019
0.912
0.001
0.005
0.094
3.816
0.001
0.005
0.101
4.112
1.82
0.01
0.03
0.53
21.72
0.07
0.10
5.15
44.74
1.07
0.06
0.06
0.05
2.48
0.00
0.01
0.26
10.37
0.00
0.01
0.28
11.18
1.82
18243
leadframe
267
iron
5349
217175
748
copper
gold
22.29
0.07
222858
748
wire
encapsulation
organic material
plastics
carbon black
epoxy resin
silicondioxide
tin
999
51470
447237
10746
552
inorganic material
non noble metal
noble metal
60676-86-0
7440-31-5
7440-22-4
7440-22-4
7440-31-5
7439-92-1
7723-14-0
7440-66-6
7439-89-6
7440-50-8
7723-14-0
7440-66-6
7439-89-6
7440-50-8
49.99
1.07
0.06
499706
10746
552
leadfinish
plating
silver
solder
noble metal
silver
649
non noble metal
non noble metal
inorganic material
non noble metal
non noble metal
non noble metal
inorganic material
non noble metal
non noble metal
non noble metal
< 10%
tin
519
lead
2.59
10.64
11.47
24797
32
25965
heatspreader
heat sink CLIP
*deviation
phosphorus
zinc
128
iron
2555
103741
34
copper
phosphorus
zinc
106456
138
iron
2753
111801
copper
114726
Sum in total: 100.00
1000000
Important Remarks:
1.
2.
3.
Infineon Technologies AG provides full material declaration based on information provided by third parties and
has taken and continues to take reasonable steps to provide representative and accurate information.
Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be
proprietary, and thus CAS numbers and other limited information may not be available for release.
All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any
time due to technical requirements and development without notification.
This product is in compliance with EU Directive 2011/65/EU (RoHS) and contains Pb according RoHS exemption
7a, Lead in high melting temperature type solders.
Company
Address
Internet
Infineon Technologies AG
81726 München
www.infineon.com