Material Content Data Sheet
Sales Product Name IFX9201SG
Issued
20. August 2015
372.97 mg
MA#
MA001409748
PG-DSO-12-17
Package
Weight*
Average
Mass
[%]
Average
CAS#
Weight
[mg]
Sum
Mass
[%]
Sum
Construction Element
Material Group
Substances
[ppm]
if applicable
[ppm]
chip
inorganic material
inorganic material
non noble metal
non noble metal
non noble metal
non noble metal
organic material
plastics
silicon
7440-21-3
7723-14-0
7440-66-6
7439-89-6
7440-50-8
7440-50-8
1333-86-4
-
5.425
0.060
0.240
4.792
194.567
1.484
0.310
14.253
140.362
3.243
2.024
0.155
0.124
5.928
1.45
0.02
0.06
1.28
52.19
0.40
0.08
3.82
37.63
0.87
0.54
0.04
0.03
1.59
1.45
14546
161
14546
leadframe
phosphorus
zinc
642
iron
12848
521675
3978
831
copper
copper
carbon black
epoxy resin
silicondioxide
tin
53.55
0.40
535326
3978
wire
encapsulation
38215
376338
8696
5427
416
inorganic material
non noble metal
noble metal
60676-86-0
7440-31-5
7440-22-4
7440-22-4
7440-31-5
7439-92-1
41.53
0.87
0.54
415384
8696
leadfinish
plating
silver
5427
solder
noble metal
silver
non noble metal
non noble metal
< 10%
tin
333
lead
1.66
15894
16643
*deviation
Sum in total: 100.00
1000000
Important Remarks:
1.
2.
3.
Infineon Technologies AG provides full material declaration based on information provided by third parties and
has taken and continues to take reasonable steps to provide representative and accurate information.
Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be
proprietary, and thus CAS numbers and other limited information may not be available for release.
All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any
time due to technical requirements and development without notification.
This product is in compliance with EU Directive 2011/65/EU (RoHS) and contains Pb according RoHS exemption
7a, Lead in high melting temperature type solders.
Company
Address
Internet
Infineon Technologies AG
81726 München
www.infineon.com