Material Content Data Sheet
Sales Product Name ICE3B0565
Issued
14. November 2014
MA#
MA001044382
PG-DIP-8-13
Package
Weight*
556.90 mg
Average
Mass
[%]
Average
CAS#
Weight
[mg]
Sum
[%]
Sum
Construction Element
Material Group
Substances
Mass
[ppm]
if applicable
[ppm]
chip
inorganic material
inorganic material
non noble metal
non noble metal
non noble metal
noble metal
silicon
7440-21-3
7723-14-0
7440-66-6
7439-89-6
7440-50-8
7440-57-5
1333-86-4
-
3.262
0.054
0.59
0.01
0.04
0.77
31.33
0.04
0.20
6.36
58.96
1.35
0.14
0.03
0.18
0.59
5858
96
5858
leadframe
phosphorus
zinc
0.215
386
iron
4.297
7716
313294
428
copper
174.475
0.238
32.15
0.04
321492
428
wire
gold
encapsulation
organic material
plastics
carbon black
epoxy resin
silicondioxide
tin
1.095
1966
63551
589649
13460
1429
325
35.392
328.378
7.496
inorganic material
non noble metal
noble metal
60676-86-0
7440-31-5
7440-22-4
-
65.52
1.35
0.14
655166
13460
1429
leadfinish
plating
glue
silver
0.796
plastics
epoxy resin
silver
0.181
noble metal
7440-22-4
1.026
0.21
1842
2167
*deviation
< 10%
Sum in total: 100.00
1000000
Important Remarks:
1.
2.
3.
Infineon Technologies AG provides full material declaration based on information provided by third parties and
has taken and continues to take reasonable steps to provide representative and accurate information.
Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be
proprietary, and thus CAS numbers and other limited information may not be available for release.
All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any
time due to technical requirements and development without notification.
This product is in compliance with EU Directive 2011/65/EU (RoHS) and does not use any exemption.
Company
Address
Internet
Infineon Technologies AG
81726 München
www.infineon.com