Material Content Data Sheet
Sales Product Name TLE6208-6G
Issued
16. September 2015
MA#
MA001224142
PG-DSO-28-41
Package
Weight*
835.34 mg
Average
Mass
[%]
Average
CAS#
Weight
[mg]
Sum
[%]
Sum
Construction Element
Material Group
Substances
Mass
[ppm]
if applicable
[ppm]
chip
inorganic material
inorganic material
non noble metal
non noble metal
non noble metal
non noble metal
organic material
plastics
silicon
7440-21-3
7723-14-0
7440-66-6
7439-89-6
7440-50-8
7440-50-8
1333-86-4
-
14.614
0.073
1.75
0.01
0.03
0.70
28.37
0.15
0.14
6.23
61.33
0.59
0.23
0.12
0.35
1.75
17495
87
17495
leadframe
phosphorus
zinc
0.292
349
iron
5.837
6988
283726
1514
1354
62281
613332
5882
2271
1180
3541
copper
237.007
1.265
29.11
0.15
291150
1514
wire
copper
encapsulation
carbon black
epoxy resin
silicondioxide
tin
1.131
52.026
512.339
4.913
inorganic material
non noble metal
noble metal
60676-86-0
7440-31-5
7440-22-4
-
67.70
0.59
0.23
676967
5882
leadfinish
plating
glue
silver
1.897
2271
plastics
epoxy resin
silver
0.986
noble metal
7440-22-4
2.958
0.47
4721
*deviation
< 10%
Sum in total: 100.00
1000000
Important Remarks:
1.
2.
3.
Infineon Technologies AG provides full material declaration based on information provided by third parties and
has taken and continues to take reasonable steps to provide representative and accurate information.
Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be
proprietary, and thus CAS numbers and other limited information may not be available for release.
All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any
time due to technical requirements and development without notification.
This product is in compliance with EU Directive 2011/65/EU (RoHS) and does not use any exemption.
Company
Address
Internet
Infineon Technologies AG
81726 München
www.infineon.com