Material Content Data Sheet
Sales Product Name BTS54220-LBA
Issued
7. August 2015
184.28 mg
MA#
MA001403228
PG-TSON-24-3
Package
Weight*
Average
Mass
[%]
Average
CAS#
Weight
[mg]
Sum
Mass
[%]
Sum
Construction Element
Material Group
Substances
[ppm]
if applicable
[ppm]
chip
inorganic material
inorganic material
non noble metal
non noble metal
non noble metal
non noble metal
organic material
plastics
silicon
7440-21-3
7723-14-0
7440-66-6
7439-89-6
7440-50-8
7440-50-8
1333-86-4
-
10.076
0.021
0.084
1.685
68.425
2.586
0.183
9.428
81.920
2.578
0.378
0.173
0.138
6.604
5.47
0.01
0.05
0.91
37.13
1.40
0.10
5.12
44.45
1.40
0.21
0.09
0.08
3.58
5.47
54680
114
54680
leadframe
phosphorus
zinc
457
iron
9145
371309
14034
993
copper
copper
carbon black
epoxy resin
silicondioxide
tin
38.10
1.40
381025
14034
wire
encapsulation
51159
444540
13991
2051
938
inorganic material
non noble metal
noble metal
60676-86-0
7440-31-5
7440-22-4
7440-22-4
7440-31-5
7439-92-1
49.67
1.40
0.21
496692
13991
2051
leadfinish
plating
silver
solder
noble metal
silver
non noble metal
non noble metal
< 10%
tin
751
lead
3.75
35838
37527
*deviation
Sum in total: 100.00
1000000
Important Remarks:
1.
2.
3.
Infineon Technologies AG provides full material declaration based on information provided by third parties and
has taken and continues to take reasonable steps to provide representative and accurate information.
Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be
proprietary, and thus CAS numbers and other limited information may not be available for release.
All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any
time due to technical requirements and development without notification.
This product is in compliance with EU Directive 2011/65/EU (RoHS) and contains Pb according RoHS exemption
7a, Lead in high melting temperature type solders.
Company
Address
Internet
Infineon Technologies AG
81726 München
www.infineon.com