Material Content Data Sheet
Sales Product Name BFS 483 H6327
Issued
27. November 2015
MA#
MA000844164
Package
PG-SOT363-6-1
Weight*
6.27 mg
Average
Mass
[%]
Average
CAS#
Weight
[mg]
Sum
[%]
Sum
Construction Element
Material Group
Substances
Mass
[ppm]
if applicable
[ppm]
chip
noble metal
gold
7440-57-5
7440-31-5
7440-21-3
7440-21-3
7440-32-6
7440-47-3
7440-50-8
7440-57-5
1333-86-4
-
0.002
0.000
0.013
0.001
0.003
0.009
2.869
0.014
0.031
0.664
2.392
0.216
0.056
0.03
0.01
0.21
0.01
0.05
0.14
45.76
0.22
0.49
10.58
38.16
3.44
0.90
288
74
non noble metal
inorganic material
inorganic material
non noble metal
non noble metal
non noble metal
noble metal
tin
silicon
0.25
2132
92
2494
leadframe
silicon
titanium
chromium
copper
gold
460
1379
457664
2184
4923
105849
381550
34438
8967
45.96
0.22
459595
2184
wire
encapsulation
organic material
plastics
carbon black
epoxy resin
silicondioxide
tin
inorganic material
non noble metal
noble metal
60676-86-0
7440-31-5
7440-22-4
49.23
3.44
0.90
492322
34438
leadfinish
plating
silver
8967
*deviation
< 10%
Sum in total: 100.00
1000000
Important Remarks:
1.
2.
3.
Infineon Technologies AG provides full material declaration based on information provided by third parties and
has taken and continues to take reasonable steps to provide representative and accurate information.
Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be
proprietary, and thus CAS numbers and other limited information may not be available for release.
All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any
time due to technical requirements and development without notification.
This product is in compliance with EU Directive 2011/65/EU (RoHS) and does not use any exemption.
Company
Address
Internet
Infineon Technologies AG
81726 München
www.infineon.com