Material Content Data Sheet
Sales Product Name IPP086N10N3 G
Issued
29. August 2013
2027.01 mg
MA#
MA000973716
Package
PG-TO220-3-123
Weight*
Average
Mass
[%]
Average
CAS#
Weight
[mg]
Sum
Mass
[%]
Sum
Construction Element
Material Group
Substances
[ppm]
if applicable
[ppm]
chip
inorganic material
non noble metal
inorganic material
non noble metal
non noble metal
organic material
plastics
silicon
7440-21-3
7439-89-6
7723-14-0
7440-50-8
7429-90-5
1333-86-4
-
4.609
1.407
0.23
0.07
0.02
69.29
0.31
0.12
3.34
25.34
1.06
0.09
0.01
0.03
0.09
0.23
2274
694
2274
leadframe
iron
phosphorus
copper
0.422
208
1404.801
6.213
69.38
0.31
693043
3065
1152
33402
253393
10588
870
693945
3065
wire
aluminium
carbon black
epoxy resin
silicondioxide
tin
encapsulation
2.335
67.706
513.629
21.462
1.764
inorganic material
non noble metal
non noble metal
non noble metal
noble metal
60676-86-0
7440-31-5
7440-02-0
7440-36-0
7440-22-4
7440-31-5
28.80
1.06
0.09
287947
10588
870
leadfinish
plating
nickel
solder
antimony
silver
0.266
131
0.665
328
non noble metal
< 10%
tin
1.728
0.13
852
1311
*deviation
Sum in total: 100,00
1000000
Important Remarks:
1.
2.
3.
Infineon Technologies AG provides full material declaration based on information provided by third parties and
has taken and continues to take reasonable steps to provide representative and accurate information.
Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be
proprietary, and thus CAS numbers and other limited information may not be available for release.
All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any
time due to technical requirements and development without notification.
Company
Address
Internet
Infineon Technologies AG
81726 München
www.infineon.com