Material Content Data Sheet
Sales Product Name IGW25T120
Issued
29. August 2013
6048.73 mg
MA#
MA000923534
Package
PG-TO247-3-41
Weight*
Average
Mass
[%]
Average
CAS#
Weight
[mg]
Sum
Mass
[%]
Sum
Construction Element
Material Group
Substances
[ppm]
if applicable
[ppm]
chip
inorganic material
non noble metal
inorganic material
non noble metal
non noble metal
organic material
plastics
silicon
7440-21-3
7439-89-6
7723-14-0
7440-50-8
7429-90-5
1333-86-4
-
8.851
3.972
0.15
0.07
0.02
65.58
0.07
0.33
6.27
26.42
0.53
0.48
0.01
0.02
0.05
0.15
1463
657
1463
leadframe
iron
phosphorus
copper
1.192
197
3967.074
4.355
65.67
0.07
655853
720
656707
720
wire
aluminium
carbon black
epoxy resin
silicondioxide
tin
encapsulation
19.976
379.553
1598.119
31.874
29.065
0.469
3303
62749
264207
5270
4805
78
inorganic material
non noble metal
non noble metal
non noble metal
noble metal
60676-86-0
7440-31-5
7440-02-0
7440-36-0
7440-22-4
7440-31-5
33.02
0.53
0.48
330259
5270
leadfinish
plating
nickel
4805
solder
antimony
silver
1.173
194
non noble metal
< 10%
tin
3.051
0.08
504
776
*deviation
Sum in total: 100,00
1000000
Important Remarks:
1.
2.
3.
Infineon Technologies AG provides full material declaration based on information provided by third parties and
has taken and continues to take reasonable steps to provide representative and accurate information.
Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be
proprietary, and thus CAS numbers and other limited information may not be available for release.
All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any
time due to technical requirements and development without notification.
Company
Address
Internet
Infineon Technologies AG
81726 München
www.infineon.com