Material Content Data Sheet
Sales Product Name TLE7240SL
Issued
5. December 2014
147.00 mg
MA#
MA000920372
PG-SSOP-24-7
Package
Weight*
Average
Mass
[%]
Average
Sum
CAS#
Weight
[mg]
Sum
Construction Element
Material Group
Substances
Mass
[%]
[ppm]
if applicable
[ppm]
29540
106
chip
inorganic material
inorganic material
non noble metal
non noble metal
non noble metal
noble metal
silicon
7440-21-3
7723-14-0
7440-66-6
7439-89-6
7440-50-8
7440-57-5
1333-86-4
-
4.342
0.016
0.062
1.245
50.568
0.780
0.172
7.925
78.042
1.680
0.365
0.396
1.404
2.95
0.01
0.04
0.85
34.40
0.53
0.12
5.39
53.09
1.14
0.25
0.27
0.96
2.95
29540
leadframe
phosphorus
zinc
424
iron
8472
copper
35.30
0.53
344005
5307
353007
5307
wire
gold
encapsulation
organic material
plastics
carbon black
epoxy resin
silicondioxide
tin
1172
53911
530905
11427
2485
inorganic material
non noble metal
noble metal
60676-86-0
7440-31-5
7440-22-4
-
58.60
1.14
0.25
585988
11427
2485
leadfinish
plating
glue
silver
plastics
acrylic resin
silver
2694
noble metal
7440-22-4
1.23
9552
12246
*deviation
< 10%
Sum in total: 100.00
1000000
Important Remarks:
1.
2.
3.
Infineon Technologies AG provides full material declaration based on information provided by third parties and
has taken and continues to take reasonable steps to provide representative and accurate information.
Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be
proprietary, and thus CAS numbers and other limited information may not be available for release.
All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any
time due to technical requirements and development without notification.
This product is in compliance with EU Directive 2011/65/EU (RoHS) and does not use any exemption.
Company
Address
Internet
Infineon Technologies AG
81726 München
www.infineon.com