Material Content Data Sheet
Sales Product Name SKW20N60HS
Issued
29. August 2013
6048.28 mg
MA#
MA000978300
Package
PG-TO247-3-41
Weight*
Average
Mass
[%]
Average
CAS#
Weight
[mg]
Sum
Mass
[%]
Sum
Construction Element
Material Group
Substances
[ppm]
if applicable
[ppm]
chip
inorganic material
non noble metal
inorganic material
non noble metal
non noble metal
organic material
plastics
silicon
7440-21-3
7439-89-6
7723-14-0
7440-50-8
7429-90-5
1333-86-4
-
5.487
0.530
0.09
0.01
0.00
8.75
0.12
0.33
6.28
26.43
0.53
0.48
0.01
0.02
0.04
0.02
0.06
56.83
0.09
907
88
907
leadframe
iron
phosphorus
copper
0.159
26
529.068
7.397
8.76
0.12
87474
1223
3304
62779
264334
5270
4805
62
87588
1223
wire
aluminium
carbon black
epoxy resin
silicondioxide
tin
encapsulation
19.985
379.706
1598.763
31.874
29.065
0.376
inorganic material
non noble metal
non noble metal
non noble metal
noble metal
60676-86-0
7440-31-5
7440-02-0
7440-36-0
7440-22-4
7440-31-5
7723-14-0
7439-89-6
7440-50-8
33.04
0.53
0.48
330417
5270
leadfinish
plating
nickel
4805
solder
antimony
silver
0.940
155
non noble metal
inorganic material
non noble metal
non noble metal
< 10%
tin
2.444
0.07
404
621
heatspreader
*deviation
phosphorus
iron
1.033
171
3.442
569
copper
3438.006
56.91
568429
569169
Sum in total: 100,00
1000000
Important Remarks:
1.
2.
3.
Infineon Technologies AG provides full material declaration based on information provided by third parties and
has taken and continues to take reasonable steps to provide representative and accurate information.
Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be
proprietary, and thus CAS numbers and other limited information may not be available for release.
All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any
time due to technical requirements and development without notification.
Company
Address
Internet
Infineon Technologies AG
81726 München
www.infineon.com