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M5M5V2132GP-5H PDF预览

M5M5V2132GP-5H

更新时间: 2024-11-21 19:22:55
品牌 Logo 应用领域
三菱 - MITSUBISHI 时钟静态存储器内存集成电路
页数 文件大小 规格书
14页 167K
描述
Cache SRAM, 64KX32, 5ns, CMOS, PQFP100, 14 X 20 MM, 0.65 MM PITCH, PLASTIC, TQFP-100

M5M5V2132GP-5H 技术参数

是否Rohs认证: 不符合生命周期:Obsolete
零件包装代码:QFP包装说明:QFP, QFP100(UNSPEC)
针数:100Reach Compliance Code:unknown
ECCN代码:3A991.B.2.AHTS代码:8542.32.00.41
风险等级:5.85最长访问时间:5 ns
最大时钟频率 (fCLK):133 MHzI/O 类型:COMMON
JESD-30 代码:R-PQFP-G100JESD-609代码:e0
内存密度:2097152 bit内存集成电路类型:CACHE SRAM
内存宽度:32功能数量:1
端子数量:100字数:65536 words
字数代码:64000工作模式:SYNCHRONOUS
最高工作温度:70 °C最低工作温度:
组织:64KX32输出特性:3-STATE
封装主体材料:PLASTIC/EPOXY封装代码:QFP
封装等效代码:QFP100(UNSPEC)封装形状:RECTANGULAR
封装形式:FLATPACK并行/串行:PARALLEL
峰值回流温度(摄氏度):NOT SPECIFIED电源:3.3 V
认证状态:Not Qualified最大待机电流:0.002 A
最小待机电流:3.14 V子类别:SRAMs
最大压摆率:0.3 mA最大供电电压 (Vsup):3.47 V
最小供电电压 (Vsup):3.13 V标称供电电压 (Vsup):3.3 V
表面贴装:YES技术:CMOS
温度等级:COMMERCIAL端子面层:Tin/Lead (Sn/Pb)
端子形式:GULL WING端子位置:QUAD
处于峰值回流温度下的最长时间:NOT SPECIFIEDBase Number Matches:1

M5M5V2132GP-5H 数据手册

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Mar.24.'97 ver.G  
M5M5V2132GP-5MHIT,-S5U,B-I6SH,-I7L,S-I8s  
2097152-BIT(65536-WORD BY 32-BIT) SYNCHRONOUS BURST SRAM  
When CLK is stopped and all inputs (Address, Burst control,  
DESCRIPTION  
CLK etc. ) are fixed in CMOS level, the SRAM becomes in the  
power-down state that is called "CLK stopped stand-by mode".  
During CLK stopped stand-by mode, power supply current is  
almost same as snooze mode even if the SRAM is selected.  
When CLK is active again, the SRAM immediately recovers from  
CLK stopped stand-by mode to normal operation mode.  
The M5M5V2132 is a family of 2M bit synchronous SRAMs  
organized as 65536-words of 32-bit. The M5M5V2132 provides a  
high speed secondary cache solution for microprocessors. The  
design integrates a 2-bit burst counter, input and output registers  
with the ultra fast 2M bit SRAM on a single monolithic circuit. This  
design reduces component count of cache data RAM solutions.  
Mitsubishi's SRAMs are fabricated with high-performance, low  
power Super CMOS technology, providing greater reliability. This  
device operates on 3.3V power / 2.5V I/O supply or a single 3.3V  
power supply , and are directly LVTTL compatible.  
The burst mode control (MODE), and the flow-through enable  
(FT) are DC operated pins. MODE pin will allow the choice of  
either an interleaved burst, or a linear burst. FT pin normally is  
VDD. When FT is pulled Vss, the SRAM changes non-pipelined  
type with flow-through output. FT input fixed to Vss is only used  
for a test mode.  
FEATURES  
Access times / Cycle times  
The burst operation is initiated by either address status  
processor (ADSP) or address status controller (ADSC). The burst  
advance pin (ADV) controls subsequent burst addresses.  
......................  
......................  
5.0ns/7.5ns (133MHz)  
5.0ns/8.5ns (117MHz)  
5.5ns/10.0ns(100MHz)  
7.0ns/13.3ns (75MHz)  
8.0ns/15.0ns (66MHz)  
M5M5V2132GP-5H  
M5M5V2132GP-5  
M5M5V2132GP-6  
M5M5V2132GP-7  
M5M5V2132GP-8  
.....................  
.....................  
.....................  
...........................  
...........................  
875mW (typ)  
3.3mW (typ)  
Low power dissipation  
Active(133MHz)  
Stand-by  
.......  
-5H,-5,-6  
3.3V(3.13V ~ 3.47V )power  
/ 2.5V(2.37V ~ 2.90V) I/O supply  
or Single 3.3V(3.13V ~ 3.47V )power supply  
3.3V(3.13V ~ 3.60V )power  
.......  
-7 ,-8  
/ 2.5V(2.37V ~ 2.90V) I/O supply  
or Single 3.3V(3.13V ~ 3.60V )power supp  
Package  
100pin TQFP  
2
Body Size (14.0 x 20.0 mm ) Pin Pitch (0.65 mm)  
Fully registered inputs and outputs (Pipeline operation)  
Global write control or individual byte write control  
MODE pin allows either liner or interleaved burst  
Snooze mode pin (ZZ) for power down  
CLK stopped stand-by mode  
32-bit wide data I/O  
APPLICATION  
PentiumTM/ PowerPCTM and High-end processor second level  
caches  
FUNCTION  
Synchronous circuitry allows for precise cycle control triggered by  
a positive edge clock transition. Synchronous signals include : all  
addresses, all data inputs, all chip selects (S1, S2, S2), burst  
control inputs (ADSC, ADSP, ADV) and write enables (MBW, GW,  
BW1, BW2, BW3, BW4). S2 and S2 provide easy depth expansion.  
The write operation can be performed by two methods. The  
global write enable (GW) will perform a write to all 32 bits. Byte  
wide writes are controlled by the master byte write enable (MBW)  
and the 4 individual byte write enables (BW1-BW4). The byte write  
cycle will write from one to four bytes. The write cycle is internally  
self-timed, eliminating the complex signal generation of an off chip  
write.  
Asynchronous signals are output enable (OE), snooze mode pin  
(ZZ) and clock (CLK). The HIGH input of ZZ pin puts the SRAM in  
the power-down state. When ZZ is pulled to LOW, the SRAM  
normally operates after 30ns of the wake up period.  
1

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