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M5M4V4405CTP-6S PDF预览

M5M4V4405CTP-6S

更新时间: 2024-11-28 22:16:55
品牌 Logo 应用领域
三菱 - MITSUBISHI 存储内存集成电路光电二极管动态存储器
页数 文件大小 规格书
27页 295K
描述
EDO (HYPER PAGE MODE) 4194304-BIT(1048576-WORD BY 4-BIT) DYNAMIC RAM

M5M4V4405CTP-6S 技术参数

是否无铅:含铅是否Rohs认证:不符合
生命周期:Obsolete零件包装代码:TSOP
包装说明:TSOP2, TSOP20/26,.36针数:20
Reach Compliance Code:unknownECCN代码:EAR99
HTS代码:8542.32.00.02风险等级:5.92
Is Samacsys:N访问模式:FAST PAGE WITH EDO
最长访问时间:60 ns其他特性:RAS ONLY/CAS BEFORE RAS/HIDDEN/SELF REFRESH
I/O 类型:COMMONJESD-30 代码:R-PDSO-G20
JESD-609代码:e0长度:17.14 mm
内存密度:4194304 bit内存集成电路类型:EDO DRAM
内存宽度:4功能数量:1
端口数量:1端子数量:20
字数:1048576 words字数代码:1000000
工作模式:ASYNCHRONOUS最高工作温度:70 °C
最低工作温度:组织:1MX4
输出特性:3-STATE封装主体材料:PLASTIC/EPOXY
封装代码:TSOP2封装等效代码:TSOP20/26,.36
封装形状:RECTANGULAR封装形式:SMALL OUTLINE, THIN PROFILE
峰值回流温度(摄氏度):NOT SPECIFIED电源:3.3 V
认证状态:Not Qualified刷新周期:1024
座面最大高度:1.2 mm自我刷新:YES
最大待机电流:0.00005 A子类别:DRAMs
最大压摆率:0.085 mA最大供电电压 (Vsup):3.6 V
最小供电电压 (Vsup):3 V标称供电电压 (Vsup):3.3 V
表面贴装:YES技术:CMOS
温度等级:COMMERCIAL端子面层:Tin/Lead (Sn/Pb)
端子形式:GULL WING端子节距:1.27 mm
端子位置:DUAL处于峰值回流温度下的最长时间:NOT SPECIFIED
宽度:7.62 mmBase Number Matches:1

M5M4V4405CTP-6S 数据手册

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MITSUBISHI LSIs  
M5M4V4405CJ,TP-6,-7,-6S,-7S
EDO(HYPERPAGEMODE)4194304-BIT(1048576-WORDBY 4-BIT) DYNAMICRAM
DESCRIPTION  
This is family of 1048576-word by 4-bit dynamic RAMS,  
PIN CONFIGURATION (TOP VIEW)  
a
fabricated with the high performance CMOS process,and is ideal  
for large-capacity memory systems where high speed, low power  
dissipation , and low costs are essential.  
The use of quadruple-layer polysilicon process combined with  
silicide technology and a single-transistor dynamic storage stacked  
capacitor cell provide high circuit density at reduced costs.  
Multiplexed address inputs permit both a reduction in pins and an  
increase in system densities.  
DQ1  
DQ2  
W
1
2
3
4
5
26  
25  
VSS  
DQ4  
24  
23  
DQ3  
CAS  
RAS  
A9  
22 OE  
Self or extended refresh current is low enough for battery  
back-up application.  
FEATURES  
9
A8  
18  
A0  
A1  
Address  
access access access access  
time time time time  
RAS  
CAS  
OE  
Power  
dissipa-  
tion  
Cycle  
time  
10  
A7  
17  
16 A6  
15  
Type name  
A2 11  
(max.ns) (max.ns)(max.ns)(max.ns) (min.ns) (typ.mW)  
A3  
12  
13  
A5  
14 A4  
M5M4V4405CXX-6, -6S  
M5M4V4405CXX-7, -7S  
60  
70  
15  
20  
30  
35  
15  
20  
110  
130  
264  
231  
VCC  
XX=J, TP  
Outline 26P0J (300mil SOJ)  
Standard 26 pin SOJ, 26 pin TSOP(II)  
Single 3.3V±0.3V supply  
Low stand-by power dissipation  
CMOS lnput level .................................................1.8mW(Max)*  
CMOS lnput level ................................................180µW(Max)  
Low operating power dissipation  
M5M4V4405Cxx-6, -6S .....................................288.0mW (Max)  
M5M4V4405Cxx-7, -7S ....................................252.0mW (Max)  
Self refresh capabiility*  
DQ1  
DQ2  
W
1
2
3
4
5
26  
25  
VSS  
DQ4  
DQ3  
CAS  
OE  
24  
23  
RAS  
A9  
Self refresh current ..............................................100µA(max)  
Extended refresh capability*  
22  
Extended refresh current ....................................100µA(max)  
Hyper-page mode (1024-bit random access), Read-modify- write,  
RAS-only refresh CAS before RAS refresh, Hidden refresh, CBR  
self refresh(-6S,-7S) capabilities.  
Early-write mode and OE and W to control output buffer impedance  
1024 refresh cycles every 16.4ms (A0~A9)  
1024refresh cycle every128ms (A0~A9)*  
9
A8  
A7  
A6  
A5  
A0  
A1  
18  
17  
16  
15  
10  
A2 11  
*: Applicable to self refresh version (M5M4V4405Cxx-6S,-7S:  
option) only  
A3  
12  
13  
14 A4  
VCC  
Outline 26P3Z-E (300mil TSOP)  
APPLICATION  
Lap top personal computer,Solid state disc, Microcomputer  
memory, Refresh memory for CRT  
PIN DESCRIPTION  
Function  
Address inputs  
Pin name  
A0~A9  
DQ1~DQ4  
Data inputs / outputs  
Row address strobe input  
Column address strobe input  
Write control input  
RAS  
CAS  
W
OE  
VCC  
VSS  
Output enable input  
Power supply (+3.3V)  
Ground (0V)  
1

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