生命周期: | Active | 包装说明: | SODIMM-200 |
Reach Compliance Code: | unknown | 风险等级: | 5.68 |
Is Samacsys: | N | 访问模式: | DUAL BANK PAGE BURST |
最长访问时间: | 0.45 ns | 其他特性: | AUTO/SELF REFRESH; SEATED HGT-NOM; WD-MAX |
JESD-30 代码: | R-XZMA-N200 | 长度: | 67.6 mm |
内存密度: | 8589934592 bit | 内存集成电路类型: | DDR DRAM MODULE |
内存宽度: | 64 | 功能数量: | 1 |
端口数量: | 1 | 端子数量: | 200 |
字数: | 134217728 words | 字数代码: | 128000000 |
工作模式: | SYNCHRONOUS | 最高工作温度: | 85 °C |
最低工作温度: | 组织: | 128MX64 | |
封装主体材料: | UNSPECIFIED | 封装代码: | DIMM |
封装形状: | RECTANGULAR | 封装形式: | MICROELECTRONIC ASSEMBLY |
座面最大高度: | 30.15 mm | 最大供电电压 (Vsup): | 1.9 V |
最小供电电压 (Vsup): | 1.7 V | 标称供电电压 (Vsup): | 1.8 V |
表面贴装: | NO | 技术: | CMOS |
温度等级: | OTHER | 端子形式: | NO LEAD |
端子节距: | 0.6 mm | 端子位置: | ZIG-ZAG |
宽度: | 3.8 mm | Base Number Matches: | 1 |
型号 | 品牌 | 获取价格 | 描述 | 数据表 |
M470T2953EZ3-LE7 | SAMSUNG |
获取价格 |
DDR DRAM Module, 128MX64, 0.4ns, CMOS, ROHS COMPLIANT, SODIMM-200 | |
M470T3354BG0-CD5/CC | SAMSUNG |
获取价格 |
200pin Unbuffered SODIMM based on 512Mb B-die 64bit Non-ECC | |
M470T3354BG3-CCC | SAMSUNG |
获取价格 |
DDR DRAM Module, 32MX64, 0.6ns, CMOS, SODIMM-200 | |
M470T3354BG3-CD5 | SAMSUNG |
获取价格 |
DDR DRAM Module, 32MX64, 0.5ns, CMOS, SODIMM-200 | |
M470T3354BG3-CD5/CC | SAMSUNG |
获取价格 |
200pin Unbuffered SODIMM based on 512Mb B-die 64bit Non-ECC | |
M470T3354BGZ0-CD5/CC | SAMSUNG |
获取价格 |
200pin Unbuffered SODIMM based on 512Mb B-die 64bit Non-ECC | |
M470T3354BGZ3-CD5/CC | SAMSUNG |
获取价格 |
200pin Unbuffered SODIMM based on 512Mb B-die 64bit Non-ECC | |
M470T3354BZ0-CCC | SAMSUNG |
获取价格 |
DDR DRAM Module, 32MX64, 0.6ns, CMOS, ROHS COMPLIANT, SODIMM-200 | |
M470T3354BZ0-CD5 | SAMSUNG |
获取价格 |
DDR DRAM Module, 32MX64, 0.5ns, CMOS, ROHS COMPLIANT, SODIMM-200 | |
M470T3354BZ0-LCC | SAMSUNG |
获取价格 |
DDR DRAM Module, 32MX64, 0.6ns, CMOS, ROHS COMPLIANT, SODIMM-200 |