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M470T2953EZ3-LE6 PDF预览

M470T2953EZ3-LE6

更新时间: 2024-11-24 21:04:35
品牌 Logo 应用领域
三星 - SAMSUNG 动态存储器双倍数据速率内存集成电路
页数 文件大小 规格书
20页 353K
描述
DDR DRAM Module, 128MX64, 0.45ns, CMOS, ROHS COMPLIANT, SODIMM-200

M470T2953EZ3-LE6 技术参数

生命周期:Active包装说明:SODIMM-200
Reach Compliance Code:unknown风险等级:5.68
Is Samacsys:N访问模式:DUAL BANK PAGE BURST
最长访问时间:0.45 ns其他特性:AUTO/SELF REFRESH; SEATED HGT-NOM; WD-MAX
JESD-30 代码:R-XZMA-N200长度:67.6 mm
内存密度:8589934592 bit内存集成电路类型:DDR DRAM MODULE
内存宽度:64功能数量:1
端口数量:1端子数量:200
字数:134217728 words字数代码:128000000
工作模式:SYNCHRONOUS最高工作温度:85 °C
最低工作温度:组织:128MX64
封装主体材料:UNSPECIFIED封装代码:DIMM
封装形状:RECTANGULAR封装形式:MICROELECTRONIC ASSEMBLY
座面最大高度:30.15 mm最大供电电压 (Vsup):1.9 V
最小供电电压 (Vsup):1.7 V标称供电电压 (Vsup):1.8 V
表面贴装:NO技术:CMOS
温度等级:OTHER端子形式:NO LEAD
端子节距:0.6 mm端子位置:ZIG-ZAG
宽度:3.8 mmBase Number Matches:1

M470T2953EZ3-LE6 数据手册

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SODIMM  
DDR2 SDRAM  
DDR2 Unbuffered SODIMM  
200pin Unbuffered SODIMM based on 512Mb E-die  
64bit Non-ECC  
60FBGA & 84FBGA with Pb-Free  
(RoHS compliant)  
INFORMATION IN THIS DOCUMENT IS PROVIDED IN RELATION TO SAMSUNG PRODUCTS,  
AND IS SUBJECT TO CHANGE WITHOUT NOTICE.  
NOTHING IN THIS DOCUMENT SHALL BE CONSTRUED AS GRANTING ANY LICENSE,  
EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE,  
TO ANY INTELLECTUAL PROPERTY RIGHTS IN SAMSUNG PRODUCTS OR TECHNOLOGY. ALL  
INFORMATION IN THIS DOCUMENT IS PROVIDED  
ON AS "AS IS" BASIS WITHOUT GUARANTEE OR WARRANTY OF ANY KIND.  
1. For updates or additional information about Samsung products, contact your nearest Samsung office.  
2. Samsung products are not intended for use in life support, critical care, medical, safety equipment, or similar  
applications where Product failure couldresult in loss of life or personal or physical harm, or any military or  
defense application, or any governmental procurement to which special terms or provisions may apply.  
* Samsung Electronics reserves the right to change products or specification without notice.  
Rev. 1.4 April 2007  
1 of 20  

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