是否Rohs认证: | 不符合 | 生命周期: | Obsolete |
零件包装代码: | MODULE | 包装说明: | DIMM, DIMM200,24 |
针数: | 200 | Reach Compliance Code: | unknown |
ECCN代码: | EAR99 | HTS代码: | 8542.32.00.32 |
风险等级: | 5.92 | 访问模式: | FOUR BANK PAGE BURST |
最长访问时间: | 0.75 ns | 其他特性: | AUTO/SELF REFRESH |
最大时钟频率 (fCLK): | 133 MHz | I/O 类型: | COMMON |
JESD-30 代码: | R-XDMA-N200 | 内存密度: | 1073741824 bit |
内存集成电路类型: | DDR DRAM MODULE | 内存宽度: | 64 |
湿度敏感等级: | 1 | 功能数量: | 1 |
端口数量: | 1 | 端子数量: | 200 |
字数: | 16777216 words | 字数代码: | 16000000 |
工作模式: | SYNCHRONOUS | 最高工作温度: | 70 °C |
最低工作温度: | 组织: | 16MX64 | |
输出特性: | 3-STATE | 封装主体材料: | UNSPECIFIED |
封装代码: | DIMM | 封装等效代码: | DIMM200,24 |
封装形状: | RECTANGULAR | 封装形式: | MICROELECTRONIC ASSEMBLY |
峰值回流温度(摄氏度): | 225 | 电源: | 2.5 V |
认证状态: | Not Qualified | 刷新周期: | 4096 |
自我刷新: | YES | 最大待机电流: | 0.24 A |
子类别: | DRAMs | 最大压摆率: | 3 mA |
最大供电电压 (Vsup): | 2.7 V | 最小供电电压 (Vsup): | 2.3 V |
标称供电电压 (Vsup): | 2.5 V | 表面贴装: | NO |
技术: | CMOS | 温度等级: | COMMERCIAL |
端子形式: | NO LEAD | 端子节距: | 0.6 mm |
端子位置: | DUAL | 处于峰值回流温度下的最长时间: | NOT SPECIFIED |
Base Number Matches: | 1 |
型号 | 品牌 | 获取价格 | 描述 | 数据表 |
M470L1713CT0-LA0 | SAMSUNG |
获取价格 |
DDR DRAM Module, 16MX64, 0.8ns, CMOS, SODIMM-200 | |
M470L1714BT0 | SAMSUNG |
获取价格 |
128MB DDR SDRAM MODULE(16Mx64 based on 8Mx16 DDR SDRAM) | |
M470L1714BT0-CA0 | SAMSUNG |
获取价格 |
128MB DDR SDRAM MODULE(16Mx64 based on 8Mx16 DDR SDRAM) | |
M470L1714BT0-CA2 | SAMSUNG |
获取价格 |
128MB DDR SDRAM MODULE(16Mx64 based on 8Mx16 DDR SDRAM) | |
M470L1714BT0-CB0 | SAMSUNG |
获取价格 |
128MB DDR SDRAM MODULE(16Mx64 based on 8Mx16 DDR SDRAM) | |
M470L1714BT0-CLA0 | SAMSUNG |
获取价格 |
128MB DDR SDRAM MODULE(16Mx64 based on 8Mx16 DDR SDRAM) | |
M470L1714BT0-CLA2 | SAMSUNG |
获取价格 |
128MB DDR SDRAM MODULE(16Mx64 based on 8Mx16 DDR SDRAM) | |
M470L1714BT0-CLB0 | SAMSUNG |
获取价格 |
128MB DDR SDRAM MODULE(16Mx64 based on 8Mx16 DDR SDRAM) | |
M470L1714BT0-LA2 | SAMSUNG |
获取价格 |
DDR DRAM, 16MX64, 0.75ns, CMOS, SODIMM-200 | |
M470L1714BT0-LB0 | SAMSUNG |
获取价格 |
DDR DRAM, 16MX64, 0.75ns, CMOS, SODIMM-200 |