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M36W108B100ZN1 PDF预览

M36W108B100ZN1

更新时间: 2024-11-23 12:58:03
品牌 Logo 应用领域
意法半导体 - STMICROELECTRONICS 闪存存储内存集成电路静态存储器
页数 文件大小 规格书
35页 248K
描述
SPECIALTY MEMORY CIRCUIT, PBGA48, LGA-48

M36W108B100ZN1 技术参数

是否Rohs认证: 不符合生命周期:Transferred
零件包装代码:LGA包装说明:LGA-48
针数:48Reach Compliance Code:not_compliant
HTS代码:8542.32.00.71风险等级:5.01
最长访问时间:100 ns其他特性:ALSO CONTAINS 128K X 8 SRAM
JESD-30 代码:R-PBGA-B48JESD-609代码:e0
长度:11.8 mm内存密度:8388608 bit
内存集成电路类型:MEMORY CIRCUIT内存宽度:8
混合内存类型:FLASH+SRAM功能数量:1
端子数量:48字数:1048576 words
字数代码:1000000工作模式:ASYNCHRONOUS
最高工作温度:70 °C最低工作温度:
组织:1MX8封装主体材料:PLASTIC/EPOXY
封装代码:VLGA封装等效代码:LGA48,6X8,40
封装形状:RECTANGULAR封装形式:GRID ARRAY, VERY THIN PROFILE
电源:3/3.3 V认证状态:Not Qualified
座面最大高度:1 mm最大待机电流:0.00002 A
子类别:Other Memory ICs最大压摆率:0.1 mA
最大供电电压 (Vsup):3.6 V最小供电电压 (Vsup):2.7 V
表面贴装:YES技术:CMOS
温度等级:COMMERCIAL端子面层:Tin/Lead (Sn/Pb)
端子形式:BUTT端子节距:1 mm
端子位置:BOTTOM宽度:9.8 mm
Base Number Matches:1

M36W108B100ZN1 数据手册

 浏览型号M36W108B100ZN1的Datasheet PDF文件第2页浏览型号M36W108B100ZN1的Datasheet PDF文件第3页浏览型号M36W108B100ZN1的Datasheet PDF文件第4页浏览型号M36W108B100ZN1的Datasheet PDF文件第5页浏览型号M36W108B100ZN1的Datasheet PDF文件第6页浏览型号M36W108B100ZN1的Datasheet PDF文件第7页 
M36W108T  
M36W108B  
8 Mbit (1Mb x8, Boot Block) Flash Memory and  
1 Mbit (128Kb x8) SRAM Low Voltage Multi-Memory Product  
NOT FOR NEW DESIGN  
M36W108T and M36W108B are replaced  
respectively by the M36W108AT and  
M36W108AB  
SUPPLY VOLTAGE  
– V  
= V  
= 2.7V to 3.6V: for Program,  
CCS  
CCF  
Erase and Read  
BGA  
LGA  
ACCESS TIME: 100ns  
LOW POWER CONSUMPTION  
– Read: 40mA max. (SRAM chip)  
– Stand-by: 30µA max. (SRAM chip)  
– Read: 10mA max. (Flash chip)  
– Stand-by: 100µA max. (Flash chip)  
LBGA48 (ZM)  
6 x 8 solder balls  
LGA48 (ZN)  
6 x 8 solder lands  
FLASH MEMORY  
8 Mbit (1Mb x 8) BOOT BLOCK ERASE  
Figure 1. Logic Diagram  
PROGRAMMING TIME: 10µs typical  
PROGRAM/ERASE CONTROLLER (P/E.C.)  
– Program Byte-by-Byte  
V
V
CCF CCS  
– Status Register bits and Ready/Busy Output  
MEMORY BLOCKS  
– Boot Block (Top or Bottom location)  
– Parameter and Main Blocks  
20  
8
A0-A19  
DQ0-DQ7  
RB  
BLOCK, MULTI-BLOCK and CHIP ERASE  
ERASE SUSPEND and RESUME MODES  
W
EF  
– Read and Program another Block during  
Erase Suspend  
M36W108T  
M36W108B  
G
100,000 PROGRAM/ERASE CYCLES per  
RP  
E1S  
E2S  
BLOCK  
ELECTRONIC SIGNATURE  
– Manufacturer Code: 20h  
– Device Code, M36W108T: D2h  
– Device Code, M36W108B: DCh  
V
SS  
SRAM  
AI02509  
1 Mbit (128Kb x 8)  
POWER DOWN FEATURES USING TWO  
CHIP ENABLE INPUTS  
LOW V  
DATA RETENTION: 2V  
CC  
May 1999  
1/35  
This is information on a product still in production but not recommended for new designs.  

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